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31 relations: Ball bonding, Bipolar junction transistor, Brazing, Cell (microprocessor), Central processing unit, Chip carrier, Die preparation, Electroplating, Gallium arsenide, Heat spreader, Integrated circuit, Integrated circuit design, Integrated circuit packaging, Ion implantation, Light-emitting diode, List of integrated circuit packaging types, Monocrystalline silicon, Moore's law, Multi-core processor, Photolithography, Printed circuit board, RGB color model, Semiconductor, Semiconductor device fabrication, Semiconductor intellectual property core, Substrate (electronics), Very-large-scale integration, Wafer (electronics), Wafer dicing, Wafer testing, Wire bonding.
Ball bonding
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a chip and the outside world as part of semiconductor device fabrication.
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Bipolar junction transistor
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Brazing
Brazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the adjoining metal.
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Cell (microprocessor)
Cell is a multi-core microprocessor microarchitecture that combines a general-purpose Power Architecture core of modest performance with streamlined coprocessing elements which greatly accelerate multimedia and vector processing applications, as well as many other forms of dedicated computation.
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Central processing unit
A central processing unit (CPU) is the electronic circuitry within a computer that carries out the instructions of a computer program by performing the basic arithmetic, logical, control and input/output (I/O) operations specified by the instructions.
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Chip carrier
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").
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Die preparation
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing.
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Electroplating
Electroplating is a process that uses an electric current to reduce dissolved metal cations so that they form a thin coherent metal coating on an electrode.
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Gallium arsenide
Gallium arsenide (GaAs) is a compound of the elements gallium and arsenic.
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Heat spreader
A heat spreader is a heat exchanger that moves heat between a heat source and a secondary heat exchanger whose surface area and geometry are more favorable than the source.
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Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
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Integrated circuit design
Integrated circuit design, or IC design, is a subset of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs.
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Integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion.
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Ion implantation
Ion implantation is low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the physical, chemical, or electrical properties of the target.
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Light-emitting diode
A light-emitting diode (LED) is a two-lead semiconductor light source.
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List of integrated circuit packaging types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
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Monocrystalline silicon
Monocrystalline silicon (also called "single-crystal silicon", "single-crystal Si", "mono c-Si", or mono-Si) is the base material for silicon chips used in virtually all electronic equipment today.
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Moore's law
Moore's law is the observation that the number of transistors in a dense integrated circuit doubles about every two years.
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Multi-core processor
A multi-core processor is a single computing component with two or more independent processing units called cores, which read and execute program instructions.
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Photolithography
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate.
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Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
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RGB color model
The RGB color model is an additive color model in which red, green and blue light are added together in various ways to reproduce a broad array of colors.
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Semiconductor
A semiconductor material has an electrical conductivity value falling between that of a conductor – such as copper, gold etc.
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Semiconductor device fabrication
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices.
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Semiconductor intellectual property core
In electronic design a semiconductor intellectual property core, IP core, or IP block is a reusable unit of logic, cell, or integrated circuit (commonly called a "chip") layout design that is the intellectual property of one party.
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Substrate (electronics)
A substrate (also called a wafer) is a solid (usually planar) substance onto which a layer of another substance is applied, and to which that second substance adheres.
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Very-large-scale integration
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining hundreds of thousands of transistors or devices into a single chip.
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Wafer (electronics)
A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
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Wafer dicing
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer.
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Wafer testing
Wafer testing is a step performed during semiconductor device fabrication.
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Wire bonding
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
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References
[1] https://en.wikipedia.org/wiki/Die_(integrated_circuit)
