Heat spreader and Thermal paste

Shortcuts: Differences, Similarities, Jaccard Similarity Coefficient, References.

Difference between Heat spreader and Thermal paste

Heat spreader vs. Thermal paste

A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices.

Similarities between Heat spreader and Thermal paste

Heat spreader and Thermal paste have 4 things in common (in Unionpedia): Aluminium, Heat sink, Thermal conductivity and resistivity, Thermal interface material.

Aluminium

Aluminium (Aluminum in North American English) is a chemical element; it has symbol Al and atomic number 13.

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Heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.

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Thermal conductivity and resistivity

The thermal conductivity of a material is a measure of its ability to conduct heat.

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Thermal interface material

A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them.

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The list above answers the following questions

What Heat spreader and Thermal paste have in common
What are the similarities between Heat spreader and Thermal paste

Heat spreader and Thermal paste Comparison

Heat spreader has 37 relations, while Thermal paste has 44. As they have in common 4, the Jaccard index is 4.94% = 4 / (37 + 44).

References

This article shows the relationship between Heat spreader and Thermal paste. To access each article from which the information was extracted, please visit:

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