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50 relations: Altera, Boundary scan, Celeron, Chip carrier, Die (integrated circuit), Do it yourself, Dual in-line package, Dye, Dye-and-pry, Embedded Wafer Level Ball Grid Array, Flip chip, Grid plan, Head-in-pillow defect, Heat gun, Inductance, Industrial computed tomography, Infrared heater, Integrated circuit, JEDEC, JTAG, Land grid array, Maker culture, Microprocessor, Multi-chip module, Original equipment manufacturer, Pad cratering, Pentium II, Pentium III, Pin grid array, Printed circuit board, Quad Flat No-leads package, Quad Flat Package, Random-access memory, Reflow oven, Restriction of Hazardous Substances Directive, Rework (electronics), Small Outline Integrated Circuit, SMT placement equipment, Socket M, Solder ball, Solder mask, Surface tension, Surface-mount technology, System on a chip, Thermal expansion, Thermal resistance, Thermocouple, Whisker (metallurgy), X-ray, Zero insertion force.
Altera
Altera Corporation is an American manufacturer of programmable logic devices (PLDs), reconfigurable complex digital circuits.
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Boundary scan
Boundary scan is a method for testing interconnects (wire lines) on printed circuit boards or sub-blocks inside an integrated circuit.
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Celeron
Celeron is a brand name given by Intel to a number of different low-end IA-32 and x86-64 computer microprocessor models targeted at budget personal computers.
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Chip carrier
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").
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Die (integrated circuit)
A die (pronunciation: /daɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.
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Do it yourself
"Do it yourself" ("DIY") is the method of building, modifying, or repairing things without the direct aid of experts or professionals.
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Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.
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Dye
A dye is a colored substance that has an affinity to the substrate to which it is being applied.
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Dye-and-pry
Dye-n-Pry, also called Dye And Pry, Dye and Pull, Dye Staining, or Dye Penetrant, is a destructive analysis technique used on surface mount technology (SMT) components to either perform failure analysis or inspect for solder joint integrity.
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Embedded Wafer Level Ball Grid Array
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits.
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Flip chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
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Grid plan
The grid plan, grid street plan, or gridiron plan is a type of city plan in which streets run at right angles to each other, forming a grid.
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Head-in-pillow defect
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP) is a failure of the soldering process.
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Heat gun
A heat gun is a device used to emit a stream of hot air, usually at temperatures between 100 °C and 550 °C (200-1000 °F), with some hotter models running around 760 °C (1400 °F), which can be held by hand.
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Inductance
In electromagnetism and electronics, inductance is the property of an electrical conductor by which a change in electric current through it induces an electromotive force (voltage) in the conductor.
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Industrial computed tomography
Industrial computed tomography (CT) scanning is any computer-aided tomographic process, usually X-ray computed tomography, that uses irradiation to produce three-dimensional internal and external representations of a scanned object.
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Infrared heater
An infrared heater or heat lamp is a body with a higher temperature which transfers energy to a body with a lower temperature through electromagnetic radiation.
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Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
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JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.
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JTAG
JTAG (named after the Joint Test Action Group which codified it) is an industry standard for verifying designs and testing printed circuit boards after manufacture.
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Land grid array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit.
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Maker culture
The maker culture is a contemporary culture or subculture representing a technology-based extension of DIY culture that intersects with hacker culture (which is less concerned with physical objects as it focuses on software) and revels in the creation of new devices as well as tinkering with existing ones.
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Microprocessor
A microprocessor is a computer processor that incorporates the functions of a central processing unit on a single integrated circuit (IC), or at most a few integrated circuits.
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Multi-chip module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC).
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Original equipment manufacturer
An Original Equipment Manufacturer (OEM) is a company that produces parts and equipment that may be marketed by another manufacturer.
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Pad cratering
Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB).
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Pentium II
The Pentium II brand refers to Intel's sixth-generation microarchitecture ("P6") and x86-compatible microprocessors introduced on May 7, 1997.
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Pentium III
The Pentium III (marketed as Intel Pentium III Processor, informally PIII) brand refers to Intel's 32-bit x86 desktop and mobile microprocessors based on the sixth-generation P6 microarchitecture introduced on February 26, 1999.
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Pin grid array
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging.
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Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
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Quad Flat No-leads package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards.
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Quad Flat Package
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides.
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Random-access memory
Random-access memory (RAM) is a form of computer data storage that stores data and machine code currently being used.
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Reflow oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB).
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Restriction of Hazardous Substances Directive
The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.
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Rework (electronics)
Rework (or re-work) is the term for the refinishing operation or repair of an electronic printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD).
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Small Outline Integrated Circuit
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.
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SMT placement equipment
SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB).
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Socket M
Socket M (mPGA478MT) is a CPU interface introduced by Intel in 2006 for the Intel Core line of mobile processors.
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Solder ball
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.
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Solder mask
Solder mask or solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
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Surface tension
Surface tension is the elastic tendency of a fluid surface which makes it acquire the least surface area possible.
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Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
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System on a chip
A system on a chip or system on chip (SoC) is an integrated circuit (also known as an "IC" or "chip") that integrates all components of a computer or other electronic systems.
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Thermal expansion
Thermal expansion is the tendency of matter to change in shape, area, and volume in response to a change in temperature.
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Thermal resistance
Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow.
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Thermocouple
A thermocouple is an electrical device consisting of two dissimilar electrical conductors forming electrical junctions at differing temperatures.
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Whisker (metallurgy)
Metal whiskering is a phenomenon which occurs in electrical devices when metals form long whisker-like projections over time.
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X-ray
X-rays make up X-radiation, a form of electromagnetic radiation.
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Zero insertion force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little force for insertion.
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BGA1, BGA2, Ball Grid Array, Ball-grid array, Bga mount, Ceramic ball grid array, Dye & pry, Dye and pry, EBGA, FBGA, LBGA, LFBGA, Mbga, Micro Ball Grid Array, Micro Ball Grid Arrays, Micro FCBGA, Micro-FCBGA, MicroBGA, PBGA, Plastic Ball Grid Array, Plastic ball grid array, TBGA, TFBGA, UBGA, UFBGA, ΜFCBGA.
References
[1] https://en.wikipedia.org/wiki/Ball_grid_array
