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18 relations: Ceramic, Dual in-line package, Electronics, Flash memory, Heat spreader, IC extractor, Integrated circuit, JEDEC, Lead (electronics), List of integrated circuit packaging types, Package on package, Plastic, Quad Flat Package, Reflow soldering, Semiconductor package, Surface-mount technology, Through-hole technology, Wire wrap.
Ceramic
A ceramic is a non-metallic solid material comprising an inorganic compound of metal, non-metal or metalloid atoms primarily held in ionic and covalent bonds.
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Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.
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Electronics
Electronics is the discipline dealing with the development and application of devices and systems involving the flow of electrons in a vacuum, in gaseous media, and in semiconductors.
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Flash memory
Flash memory is an electronic (solid-state) non-volatile computer storage medium that can be electrically erased and reprogrammed.
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Heat spreader
A heat spreader is a heat exchanger that moves heat between a heat source and a secondary heat exchanger whose surface area and geometry are more favorable than the source.
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IC extractor
An IC extractor is a tool for safely and quickly removing integrated circuits (ICs) from their sockets.
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Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
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JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.
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Lead (electronics)
In electronics, a lead is an electrical connection consisting of a length of wire or a metal pad (SMD) that is designed to connect two locations electrically.
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List of integrated circuit packaging types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
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Package on package
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages.
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Plastic
Plastic is material consisting of any of a wide range of synthetic or semi-synthetic organic compounds that are malleable and so can be molded into solid objects.
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Quad Flat Package
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides.
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Reflow soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint.
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Semiconductor package
A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components.
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Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
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Through-hole technology
Through-hole technology (tht), also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
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Wire wrap
Wire wrap was invented to wire telephone crossbar switches, and later adapted to construct electronic circuit boards.
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