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Computer cooling

Index Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. [1]

117 relations: Aftermarket (merchandise), Air conditioning, Air cooling, Aluminium, Apple Inc., Aquasar, ARM architecture, ATX, BIOS, Bismuth, Blade server, Blue Gene, BTX (form factor), Capillary action, Carnot cycle, Cathode ray tube, Central processing unit, Chipset, CMOS, Computer, Computer fan, Convection, Coolant, Copper, Corona discharge, CPU power dissipation, Cray-1, Crosstalk, Data center, Desktop computer, Direct current, Distribution transformer, Dynamic frequency scaling, Dynamic voltage scaling, Electrical resistivity and conductivity, Electromagnetic shielding, Emitter-coupled logic, Engineering tolerance, EPIA, Fluorinert, General Electric, Graphics processing unit, Hard disk drive, Heat capacity, Heat exchanger, Heat transfer, Heater core, HLT (x86 instruction), HVAC, IBM, ..., IBM 308X, IBM 3090, IBM System/390, Integrated circuit, Intel Atom, Internal combustion engine, International Journal of Heat and Mass Transfer, Junction temperature, Lapping, Latent heat, Liquid helium, Liquid nitrogen, Liquid oxygen, Liquid-crystal display, List of thermal conductivities, Mainframe computer, Mass production, Modding, Moving parts, Nickel, Northbridge (computing), Operating temperature, Overclocking, Oxygen, Oxyliquit, Parallel ATA, Performance per watt, Plenum space, Power Mac G5, Power management, Power supply, Quiet PC, Rack unit, Radiative cooling, Radiator, Rankine cycle, Refrigerant, Refrigeration, Refrigerator, Ribbon cable, SCSI, Serial ATA, Silicone oil, Square root of 2, Stack effect, Stress (mechanics), Supercomputer, T-Line, Tellurium, Thermal adhesive, Thermal conduction, Thermal conductivity, Thermal design power, Thermal equilibrium, Thermal grease, Thermal management (electronics), Thermally conductive pad, Thermosiphon, Transformer oil, Turbulence, Underclocking, User experience, VIA Technologies, Video card, Waste heat, Water cooling, 3M. Expand index (67 more) »

Aftermarket (merchandise)

In many economic literature, the term "aftermarket" refers to a secondary market for the goods and services that are 1) complementary or 2) related to its primary market goods (original equipment). Thus, in many industries, the primary market consists of durable goods, whereas the aftermarket consists of consumable or non-durable products or services. Accordingly, the "aftermarket goods" mainly include products and services for replacement parts, upgrade, maintenance and enhancement of the use of its original equipment.

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Air conditioning

Air conditioning (often referred to as AC, A/C, or air con) is the process of removing heat and moisture from the interior of an occupied space, to improve the comfort of occupants.

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Air cooling

Air cooling is a method of dissipating heat.

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Aluminium or aluminum is a chemical element with symbol Al and atomic number 13.

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Apple Inc.

Apple Inc. is an American multinational technology company headquartered in Cupertino, California, that designs, develops, and sells consumer electronics, computer software, and online services.

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Aquasar is a supercomputer system from IBM Research which uses hot water cooling to achieve heat efficiency.

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ARM architecture

ARM, previously Advanced RISC Machine, originally Acorn RISC Machine, is a family of reduced instruction set computing (RISC) architectures for computer processors, configured for various environments.

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ATX (Advanced Technology eXtended) is a motherboard configuration specification developed by Intel in 1995 to improve on previous ''de facto'' standards like the AT design.

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BIOS (an acronym for Basic Input/Output System and also known as the System BIOS, ROM BIOS or PC BIOS) is non-volatile firmware used to perform hardware initialization during the booting process (power-on startup), and to provide runtime services for operating systems and programs.

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Bismuth is a chemical element with symbol Bi and atomic number 83.

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Blade server

A blade server is a stripped-down server computer with a modular design optimized to minimize the use of physical space and energy.

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Blue Gene

Blue Gene is an IBM project aimed at designing supercomputers that can reach operating speeds in the PFLOPS (petaFLOPS) range, with low power consumption.

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BTX (form factor)

BTX (for Balanced Technology eXtended) is a form factor for motherboards, originally intended to be the replacement for the aging ATX motherboard form factor in late 2004 and early 2005.

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Capillary action

Capillary action (sometimes capillarity, capillary motion, capillary effect, or wicking) is the ability of a liquid to flow in narrow spaces without the assistance of, or even in opposition to, external forces like gravity.

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Carnot cycle

The Carnot cycle is a theoretical thermodynamic cycle proposed by French physicist Sadi Carnot in 1824 and expanded upon by others in the 1830s and 1840s.

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Cathode ray tube

The cathode ray tube (CRT) is a vacuum tube that contains one or more electron guns and a phosphorescent screen, and is used to display images.

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Central processing unit

A central processing unit (CPU) is the electronic circuitry within a computer that carries out the instructions of a computer program by performing the basic arithmetic, logical, control and input/output (I/O) operations specified by the instructions.

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In a computer system, a chipset is a set of electronic components in an integrated circuit known as a "Data Flow Management System" that manages the data flow between the processor, memory and peripherals.

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Complementary metal–oxide–semiconductor, abbreviated as CMOS, is a technology for constructing integrated circuits.

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A computer is a device that can be instructed to carry out sequences of arithmetic or logical operations automatically via computer programming.

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Computer fan

A computer fan is any fan inside, or attached to, a computer case used for active cooling, and may refer to fans that draw cooler air into the case from the outside, expel warm air from inside, or move air across a heat sink to cool a particular component.

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Convection is the heat transfer due to bulk movement of molecules within fluids such as gases and liquids, including molten rock (rheid).

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A coolant is a substance, typically liquid or gas, that is used to reduce or regulate the temperature of a system.

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Copper is a chemical element with symbol Cu (from cuprum) and atomic number 29.

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Corona discharge

A corona discharge is an electrical discharge brought on by the ionization of a fluid such as air surrounding a conductor that is electrically charged.

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CPU power dissipation

Central processing unit power dissipation or CPU power dissipation is the process in which central processing units (CPUs) consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.

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The Cray-1 was a supercomputer designed, manufactured and marketed by Cray Research.

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In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel.

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Data center

A data center (American English) or data centre (Commonwealth English) is a facility used to house computer systems and associated components, such as telecommunications and storage systems.

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Desktop computer

A desktop computer is a personal computer designed for regular use at a single location on or near a desk or table due to its size and power requirements.

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Direct current

Direct current (DC) is the unidirectional flow of electric charge.

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Distribution transformer

A distribution transformer or service transformer is a transformer that provides the final voltage transformation in the electric power distribution system, stepping down the voltage used in the distribution lines to the level used by the customer.

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Dynamic frequency scaling

Dynamic frequency scaling (also known as CPU throttling) is a technique in computer architecture whereby the frequency of a microprocessor can be automatically adjusted "on the fly" depending on the actual needs, to conserve power and reduce the amount of heat generated by the chip.

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Dynamic voltage scaling

Dynamic voltage scaling is a power management technique in computer architecture, where the voltage used in a component is increased or decreased, depending upon circumstances.

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Electrical resistivity and conductivity

Electrical resistivity (also known as resistivity, specific electrical resistance, or volume resistivity) is a fundamental property that quantifies how strongly a given material opposes the flow of electric current.

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Electromagnetic shielding

Electromagnetic shielding is the practice of reducing the electromagnetic field in a space by blocking the field with barriers made of conductive or magnetic materials.

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Emitter-coupled logic

In electronics, emitter-coupled logic (ECL) is a high-speed integrated circuit bipolar transistor logic family.

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Engineering tolerance

Engineering tolerance is the permissible limit or limits of variation in.

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VIA EPIA (VIA Embedded Platform Innovative Architecture) is a series of mini-ITX, em-ITX, nano-ITX, pico-ITX and pico-ITXe motherboards with integrated VIA processors.

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Fluorinert is the trademarked brand name for the line of electronics coolant liquids sold commercially by 3M.

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General Electric

General Electric Company (GE) is an American multinational conglomerate incorporated in New York and headquartered in Boston, Massachusetts.

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Graphics processing unit

A graphics processing unit (GPU) is a specialized electronic circuit designed to rapidly manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device.

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Hard disk drive

A hard disk drive (HDD), hard disk, hard drive or fixed disk is an electromechanical data storage device that uses magnetic storage to store and retrieve digital information using one or more rigid rapidly rotating disks (platters) coated with magnetic material.

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Heat capacity

Heat capacity or thermal capacity is a measurable physical quantity equal to the ratio of the heat added to (or removed from) an object to the resulting temperature change.

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Heat exchanger

A heat exchanger is a device used to transfer heat between two or more fluids.

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Heat transfer

Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems.

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Heater core

A heater core is a radiator-like device used in heating the cabin of a vehicle.

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HLT (x86 instruction)

In the x86 computer architecture, HLT (halt) is an assembly language instruction which halts the central processing unit (CPU) until the next external interrupt is fired.

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Heating, ventilation and air conditioning (HVAC) is the technology of indoor and vehicular environmental comfort.

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The International Business Machines Corporation (IBM) is an American multinational technology company headquartered in Armonk, New York, United States, with operations in over 170 countries.

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IBM 308X

The IBM 308XIBM used a capital X when referring to 308X, as did others needing an official reference; see the Congressional Record reference.

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IBM 3090

The IBM 3090 family was a high-end successor, after the IBM System/370, to the sequence begun a quarter of a century before by the IBM System/360.

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IBM System/390

The IBM System/390 was the third major generation of the System/360 line of computers.

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Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.

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Intel Atom

Intel Atom is the brand name for a line of ultra-low-voltage IA-32 and x86-64 microprocessors by Intel Corporation.

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Internal combustion engine

An internal combustion engine (ICE) is a heat engine where the combustion of a fuel occurs with an oxidizer (usually air) in a combustion chamber that is an integral part of the working fluid flow circuit.

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International Journal of Heat and Mass Transfer

International Journal of Heat and Mass Transfer is a peer-reviewed scientific journal in the field of heat transfer and mass transfer, published by Elsevier.

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Junction temperature

Junction temperature, short for transistor junction temperature, is the highest operating temperature of the actual semiconductor in an electronic device.

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Lapping is a machining process in which two surfaces are rubbed together with an abrasive between them, by hand movement or using a machine.

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Latent heat

Latent heat is thermal energy released or absorbed, by a body or a thermodynamic system, during a constant-temperature process — usually a first-order phase transition.

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Liquid helium

At standard pressure, the chemical element helium exists in a liquid form only at the extremely low temperature of −270 °C (about 4 K or −452.2 °F).

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Liquid nitrogen

Liquid nitrogen is nitrogen in a liquid state at an extremely low temperature.

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Liquid oxygen

Liquid oxygen—abbreviated LOx, LOX or Lox in the aerospace, submarine and gas industries—is one of the physical forms of elemental oxygen.

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Liquid-crystal display

A liquid-crystal display (LCD) is a flat-panel display or other electronically modulated optical device that uses the light-modulating properties of liquid crystals.

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List of thermal conductivities

In heat transfer, the thermal conductivity of a substance, k, is an intensive property that indicates its ability to conduct heat.

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Mainframe computer

Mainframe computers (colloquially referred to as "big iron") are computers used primarily by large organizations for critical applications; bulk data processing, such as census, industry and consumer statistics, enterprise resource planning; and transaction processing.

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Mass production

Mass production, also known as flow production or continuous production, is the production of large amounts of standardized products, including and especially on assembly lines.

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Modding is a slang expression that is derived from the verb "modify".

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Moving parts

The moving parts of a machine are those parts of it that move.

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Nickel is a chemical element with symbol Ni and atomic number 28.

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Northbridge (computing)

A northbridge or host bridge is one of the two chips in the core logic chipset architecture on a PC motherboard, the other being the southbridge.

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Operating temperature

An operating temperature is the temperature at which an electrical or mechanical device operates.

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Overclocking is configuration of computer hardware components to operate faster than certified by the original manufacturer, with "faster" specified as clock frequency in megahertz (MHz) or gigahertz (GHz).

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Oxygen is a chemical element with symbol O and atomic number 8.

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An Oxyliquit, also called liquid air explosive or liquid oxygen explosive, is an explosive material which is a mixture of liquid oxygen (LOX) with a suitable fuel, such as carbon (as lampblack), or an organic chemical (e.g. a mixture of soot and naphthalene), wood meal, or aluminium powder or sponge.

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Parallel ATA

Parallel ATA (PATA), originally, is an interface standard for the connection of storage devices such as hard disk drives, floppy disk drives, and optical disc drives in computers.

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Performance per watt

In computing, performance per watt is a measure of the energy efficiency of a particular computer architecture or computer hardware.

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Plenum space

A plenum space is a part of a building that can facilitate air circulation for heating and air conditioning systems, by providing pathways for either heated/conditioned or return airflows, usually at greater than atmospheric pressure.

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Power Mac G5

The Power Mac G5 is a series of personal computers designed, manufactured, and sold by Apple Computer, Inc. from 2003 to 2006 as part of the Power Mac series.

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Power management

Power Management is a feature of some electrical appliances, especially copiers, computers, GPUs and computer peripherals such as monitors and printers, that turns off the power or switches the system to a low-power state when inactive.

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Power supply

A power supply is an electrical device that supplies electric power to an electrical load.

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Quiet PC

A quiet PC is a personal computer that makes very little, or no noise.

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Rack unit

A rack unit (abbreviated U or RU) is a unit of measure defined as.

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Radiative cooling

Radiative cooling is the process by which a body loses heat by thermal radiation.

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Radiators are heat exchangers used to transfer thermal energy from one medium to another for the purpose of cooling and heating.

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Rankine cycle

The Rankine cycle is a model used to predict the performance of steam turbine systems.

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A refrigerant is a substance or mixture, usually a fluid, used in a heat pump and refrigeration cycle.

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Refrigeration is a process of removing heat from a low-temperature reservoir and transferring it to a high-temperature reservoir.

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A refrigerator (colloquially fridge, or fridgefreezer in the UK) is a popular household appliance that consists of a thermally insulated compartment and a heat pump (mechanical, electronic or chemical) that transfers heat from the inside of the fridge to its external environment so that the inside of the fridge is cooled to a temperature below the ambient temperature of the room.

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Ribbon cable

A ribbon cable (also known as multi-wire planar cable) is a cable with many conducting wires running parallel to each other on the same flat plane.

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Small Computer System Interface (SCSI) is a set of standards for physically connecting and transferring data between computers and peripheral devices.

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Serial ATA

Serial ATA (SATA, abbreviated from Serial AT Attachment) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives, optical drives, and solid-state drives.

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Silicone oil

A silicone oil is any liquid polymerized siloxane with organic side chains.

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Square root of 2

The square root of 2, or the (1/2)th power of 2, written in mathematics as or, is the positive algebraic number that, when multiplied by itself, gives the number 2.

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Stack effect

Stack effect or chimney effect is the movement of air into and out of buildings, chimneys, flue-gas stacks, or other containers, resulting from air buoyancy.

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Stress (mechanics)

In continuum mechanics, stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other, while strain is the measure of the deformation of the material.

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A supercomputer is a computer with a high level of performance compared to a general-purpose computer.

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A T-Line is a simple alternative to a pressure tank, air-trap or any other filling, bleeding, and draining device.

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Tellurium is a chemical element with symbol Te and atomic number 52.

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Thermal adhesive

Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks.

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Thermal conduction

Thermal conduction is the transfer of heat (internal energy) by microscopic collisions of particles and movement of electrons within a body.

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Thermal conductivity

Thermal conductivity (often denoted k, λ, or κ) is the property of a material to conduct heat.

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Thermal design power

The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often the CPU or GPU) that the cooling system in a computer is designed to dissipate under any workload.

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Thermal equilibrium

Two physical systems are in thermal equilibrium if there are no net flow of thermal energy between them when they are connected by a path permeable to heat.

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Thermal grease

Thermal grease (also called CPU grease, heat paste, heat sink compound, heat sink paste, thermal compound, thermal gel, thermal interface material, or thermal paste) is a thermally conductive (but usually electrically insulating) compound, which is commonly used as an interface between heat sinks and heat sources (e.g., high-power semiconductor devices).

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Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure.

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Thermally conductive pad

In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

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Thermosiphon (or thermosyphon) is a method of passive heat exchange, based on natural convection, which circulates a fluid without the necessity of a mechanical pump.

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Transformer oil

Transformer oil or insulating oil is an oil that is stable at high temperatures and has excellent electrical insulating properties.

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In fluid dynamics, turbulence or turbulent flow is any pattern of fluid motion characterized by chaotic changes in pressure and flow velocity.

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Underclocking, also known as downclocking, is modifying a computer or electronic circuit's timing settings to run at a lower clock rate than is specified.

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User experience

User Experience (UX) refers to a person's emotions and attitudes about using a particular product, system or service.

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VIA Technologies

VIA Technologies Inc., is a Taiwanese manufacturer of integrated circuits, mainly motherboard chipsets, CPUs, and memory.

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Video card

A video card (also called a display card, graphics card, display adapter or graphics adapter) is an expansion card which generates a feed of output images to a display (such as a computer monitor).

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Waste heat

Waste heat is heat that is produced by a machine, or other process that uses energy, as a byproduct of doing work.

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Water cooling

Water cooling is a method of heat removal from components and industrial equipment.

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The 3M Company, formerly known as the Minnesota Mining and Manufacturing Company, is an American multinational conglomerate corporation based in Maplewood, Minnesota, a suburb of St. Paul.

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[1] https://en.wikipedia.org/wiki/Computer_cooling

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