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Heat sink

Index Heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. [1]

55 relations: Aluminium alloy, Aspect ratio, Ball grid array, Central processing unit, Computational fluid dynamics, Computer cooling, Copper in heat exchangers, Die (integrated circuit), Emissivity, Epoxy, Fluid, Graphics processing unit, Graphite, Heat exchanger, Heat pipe, Heat pump, Heat spreader, Heat transfer, Heat transfer coefficient, Hemostat, Kelvin, Light-emitting diode, Metre, Northbridge (computing), Outer space, Overheating (electricity), Phase-change material, Polyimide, Radiative cooling, Radiator, Reed switch, Selective surface, Silicone grease, Skiving machine, Sun, Tempering (metallurgy), Thermal adhesive, Thermal conduction, Thermal conductivity, Thermal grease, Thermal management (electronics), Thermal radiation, Thermal reservoir, Thermal resistance, Thermodynamics, Thermoelectric cooling, TO-3, TO-92, Transistor, Vacuum, ..., Watt, 1050 aluminium alloy, 2N3055, 6061 aluminium alloy, 6063 aluminium alloy. Expand index (5 more) »

Aluminium alloy

Aluminium alloys (or aluminum alloys; see spelling differences) are alloys in which aluminium (Al) is the predominant metal.

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Aspect ratio

The aspect ratio of a geometric shape is the ratio of its sizes in different dimensions.

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Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

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Central processing unit

A central processing unit (CPU) is the electronic circuitry within a computer that carries out the instructions of a computer program by performing the basic arithmetic, logical, control and input/output (I/O) operations specified by the instructions.

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Computational fluid dynamics

Computational fluid dynamics (CFD) is a branch of fluid mechanics that uses numerical analysis and data structures to solve and analyze problems that involve fluid flows.

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Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits.

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Copper in heat exchangers

Heat exchangers are devices that transfer heat in order to achieve desired heating or cooling.

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Die (integrated circuit)

A die (pronunciation: /daɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.

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The emissivity of the surface of a material is its effectiveness in emitting energy as thermal radiation.

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Epoxy is either any of the basic components or the cured end products of epoxy resins, as well as a colloquial name for the epoxide functional group.

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In physics, a fluid is a substance that continually deforms (flows) under an applied shear stress.

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Graphics processing unit

A graphics processing unit (GPU) is a specialized electronic circuit designed to rapidly manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device.

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Graphite, archaically referred to as plumbago, is a crystalline allotrope of carbon, a semimetal, a native element mineral, and a form of coal.

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Heat exchanger

A heat exchanger is a device used to transfer heat between two or more fluids.

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Heat pipe

A heat pipe is a heat-transfer device that combines the principles of both thermal conductivity and phase transition to effectively transfer heat between two solid interfaces.

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Heat pump

A heat pump is a device that transfers heat energy from a source of heat to what is called a "heat sink".

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Heat spreader

A heat spreader is a heat exchanger that moves heat between a heat source and a secondary heat exchanger whose surface area and geometry are more favorable than the source.

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Heat transfer

Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems.

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Heat transfer coefficient

The heat transfer coefficient or film coefficient, or film effectiveness, in thermodynamics and in mechanics is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference, ΔT): The overall heat transfer rate for combined modes is usually expressed in terms of an overall conductance or heat transfer coefficient, U. In that case, the heat transfer rate is: where: The general definition of the heat transfer coefficient is: where: It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid.

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A hemostat (also called a hemostatic clamp, arterial forceps, or pean after Jules-Émile Péan) is a surgical tool used in many surgical procedures to control bleeding.

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The Kelvin scale is an absolute thermodynamic temperature scale using as its null point absolute zero, the temperature at which all thermal motion ceases in the classical description of thermodynamics.

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Light-emitting diode

A light-emitting diode (LED) is a two-lead semiconductor light source.

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The metre (British spelling and BIPM spelling) or meter (American spelling) (from the French unit mètre, from the Greek noun μέτρον, "measure") is the base unit of length in some metric systems, including the International System of Units (SI).

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Northbridge (computing)

A northbridge or host bridge is one of the two chips in the core logic chipset architecture on a PC motherboard, the other being the southbridge.

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Outer space

Outer space, or just space, is the expanse that exists beyond the Earth and between celestial bodies.

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Overheating (electricity)

Overheating is a phenomenon of rising of temperature in an electric circuit (or portion of a circuit).

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Phase-change material

A phase change material (PCM) is a substance with a high heat of fusion which, melting and solidifying at a certain temperature, is capable of storing and releasing large amounts of energy.

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Polyimide (sometimes abbreviated PI) is a polymer of imide monomers.

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Radiative cooling

Radiative cooling is the process by which a body loses heat by thermal radiation.

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Radiators are heat exchangers used to transfer thermal energy from one medium to another for the purpose of cooling and heating.

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Reed switch

The reed switch is an electrical switch operated by an applied magnetic field.

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Selective surface

In solar thermal collectors, a selective surface or selective absorber is a means of increasing its operation temperature and/or efficiency.

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Silicone grease

Silicone grease is a waterproof grease made by combining a silicone oil with a thickener.

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Skiving machine

Skiving or scarfing machines cut material off in slices, usually metal, but also leather or laminates.

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The Sun is the star at the center of the Solar System.

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Tempering (metallurgy)

Tempering is a process of heat treating, which is used to increase the toughness of iron-based alloys.

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Thermal adhesive

Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks.

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Thermal conduction

Thermal conduction is the transfer of heat (internal energy) by microscopic collisions of particles and movement of electrons within a body.

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Thermal conductivity

Thermal conductivity (often denoted k, λ, or κ) is the property of a material to conduct heat.

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Thermal grease

Thermal grease (also called CPU grease, heat paste, heat sink compound, heat sink paste, thermal compound, thermal gel, thermal interface material, or thermal paste) is a thermally conductive (but usually electrically insulating) compound, which is commonly used as an interface between heat sinks and heat sources (e.g., high-power semiconductor devices).

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Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure.

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Thermal radiation

Thermal radiation is electromagnetic radiation generated by the thermal motion of charged particles in matter.

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Thermal reservoir

A thermal reservoir, a short-form of thermal energy reservoir, or thermal bath is a thermodynamic system with a heat capacity that is large enough that when it is in thermal contact with another system of interest or its environment, its temperature remains effectively constant.

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Thermal resistance

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow.

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Thermodynamics is the branch of physics concerned with heat and temperature and their relation to energy and work.

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Thermoelectric cooling

Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials.

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In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.

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The TO-92 is a widely used style of semiconductor package mainly used for transistors.

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A transistor is a semiconductor device used to amplify or switch electronic signals and electrical power.

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Vacuum is space devoid of matter.

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The watt (symbol: W) is a unit of power.

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1050 aluminium alloy

1050 aluminium alloy is an aluminium-based alloy in the "commercially pure" wrought family (1000 or 1xxx series).

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The 2N3055 is a silicon NPN power transistor intended for general purpose applications.

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6061 aluminium alloy

6061 is a precipitation-hardened aluminum alloy, containing magnesium and silicon as its major alloying elements.

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6063 aluminium alloy

AA 6063 is an aluminium alloy, with magnesium and silicon as the alloying elements.

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Heat sinks, Heat sync, Heatsink, Swaged heat sink.


[1] https://en.wikipedia.org/wiki/Heat_sink

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