Logo
Unionpedia
Communication
Get it on Google Play
New! Download Unionpedia on your Android™ device!
Free
Faster access than browser!
 

Integrated circuit packaging

Index Integrated circuit packaging

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion. [1]

49 relations: Adhesive, Advanced Micro Devices, B-staging, Ball grid array, Chip carrier, Curing (chemistry), Die (integrated circuit), Dual in-line package, Electronic packaging, Epoxy, Eutectic system, Fin (extended surface), Flatpack (electronics), Flip chip, Gull wing, Integrated circuit, Integrated circuit packaging, Intel, Land grid array, Laser engraving, List of integrated circuit packaging types, McGraw-Hill Education, Microprocessor, Multi-chip module, Parasitic element (electrical networks), Pin grid array, Plating, Potting (electronics), Printed circuit board, Quad Flat Package, Quilt packaging, Semiconductor device fabrication, Semiconductor package, Small Outline Integrated Circuit, Solder, Solder ball, Surface-mount technology, System in package, Tape-automated bonding, Terminal (electronics), Thermal conduction, Thermoplastic, Thermosetting polymer, Thermosonic bonding, Thin Small Outline Package, Three-dimensional integrated circuit, Very-large-scale integration, Wafer bonding, Wire bonding.

Adhesive

An adhesive, also known as glue, cement, mucilage, or paste, is any substance applied to one surface, or both surfaces, of two separate items that binds them together and resists their separation.

New!!: Integrated circuit packaging and Adhesive · See more »

Advanced Micro Devices

Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets.

New!!: Integrated circuit packaging and Advanced Micro Devices · See more »

B-staging

B-staging is a process that utilizes heat or UV light to remove the majority of solvent from an adhesive, thereby allowing a construction to be “staged”.

New!!: Integrated circuit packaging and B-staging · See more »

Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

New!!: Integrated circuit packaging and Ball grid array · See more »

Chip carrier

In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").

New!!: Integrated circuit packaging and Chip carrier · See more »

Curing (chemistry)

Curing is a term in polymer chemistry and process engineering that refers to the toughening or hardening of a polymer material by cross-linking of polymer chains, brought about by electron beams, heat, or chemical additives.

New!!: Integrated circuit packaging and Curing (chemistry) · See more »

Die (integrated circuit)

A die (pronunciation: /daɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.

New!!: Integrated circuit packaging and Die (integrated circuit) · See more »

Dual in-line package

In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.

New!!: Integrated circuit packaging and Dual in-line package · See more »

Electronic packaging

Electronic packaging is a major discipline within the field of electrical engineering and includes a wide variety of technologies.

New!!: Integrated circuit packaging and Electronic packaging · See more »

Epoxy

Epoxy is either any of the basic components or the cured end products of epoxy resins, as well as a colloquial name for the epoxide functional group.

New!!: Integrated circuit packaging and Epoxy · See more »

Eutectic system

A eutectic system from the Greek "ευ" (eu.

New!!: Integrated circuit packaging and Eutectic system · See more »

Fin (extended surface)

In the study of heat transfer, fins are surfaces that extend from an object to increase the rate of heat transfer to or from the environment by increasing convection.

New!!: Integrated circuit packaging and Fin (extended surface) · See more »

Flatpack (electronics)

Flatpack is a US military standardized printed-circuit-board surface-mount-component package.

New!!: Integrated circuit packaging and Flatpack (electronics) · See more »

Flip chip

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

New!!: Integrated circuit packaging and Flip chip · See more »

Gull wing

The gull wing is an aircraft wing configuration with a prominent bend in the wing inner section towards the wing root.

New!!: Integrated circuit packaging and Gull wing · See more »

Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.

New!!: Integrated circuit packaging and Integrated circuit · See more »

Integrated circuit packaging

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion.

New!!: Integrated circuit packaging and Integrated circuit packaging · See more »

Intel

Intel Corporation (stylized as intel) is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley.

New!!: Integrated circuit packaging and Intel · See more »

Land grid array

The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit.

New!!: Integrated circuit packaging and Land grid array · See more »

Laser engraving

Laser engraving, which is a subset of laser marking, is the practice of using lasers to engrave an object.

New!!: Integrated circuit packaging and Laser engraving · See more »

List of integrated circuit packaging types

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.

New!!: Integrated circuit packaging and List of integrated circuit packaging types · See more »

McGraw-Hill Education

McGraw-Hill Education (MHE) is a learning science company and one of the "big three" educational publishers that provides customized educational content, software, and services for pre-K through postgraduate education.

New!!: Integrated circuit packaging and McGraw-Hill Education · See more »

Microprocessor

A microprocessor is a computer processor that incorporates the functions of a central processing unit on a single integrated circuit (IC), or at most a few integrated circuits.

New!!: Integrated circuit packaging and Microprocessor · See more »

Multi-chip module

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC).

New!!: Integrated circuit packaging and Multi-chip module · See more »

Parasitic element (electrical networks)

In electrical networks, a parasitic element is a circuit element (resistance, inductance or capacitance) that is possessed by an electrical component but which it is not desirable for it to have for its intended purpose.

New!!: Integrated circuit packaging and Parasitic element (electrical networks) · See more »

Pin grid array

A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging.

New!!: Integrated circuit packaging and Pin grid array · See more »

Plating

Plating is a surface covering in which a metal is deposited on a conductive surface.

New!!: Integrated circuit packaging and Plating · See more »

Potting (electronics)

In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents.

New!!: Integrated circuit packaging and Potting (electronics) · See more »

Printed circuit board

A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.

New!!: Integrated circuit packaging and Printed circuit board · See more »

Quad Flat Package

A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides.

New!!: Integrated circuit packaging and Quad Flat Package · See more »

Quilt packaging

Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect technology that incorporates conductive “nodules” fabricated on the sides of chips.

New!!: Integrated circuit packaging and Quilt packaging · See more »

Semiconductor device fabrication

Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices.

New!!: Integrated circuit packaging and Semiconductor device fabrication · See more »

Semiconductor package

A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components.

New!!: Integrated circuit packaging and Semiconductor package · See more »

Small Outline Integrated Circuit

A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.

New!!: Integrated circuit packaging and Small Outline Integrated Circuit · See more »

Solder

Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.

New!!: Integrated circuit packaging and Solder · See more »

Solder ball

In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.

New!!: Integrated circuit packaging and Solder ball · See more »

Surface-mount technology

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).

New!!: Integrated circuit packaging and Surface-mount technology · See more »

System in package

A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package).

New!!: Integrated circuit packaging and System in package · See more »

Tape-automated bonding

Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits.

New!!: Integrated circuit packaging and Tape-automated bonding · See more »

Terminal (electronics)

A terminal is the point at which a conductor from an electrical component, device or network comes to an end and provides a point of connection to external circuits.

New!!: Integrated circuit packaging and Terminal (electronics) · See more »

Thermal conduction

Thermal conduction is the transfer of heat (internal energy) by microscopic collisions of particles and movement of electrons within a body.

New!!: Integrated circuit packaging and Thermal conduction · See more »

Thermoplastic

A thermoplastic, or thermosoftening plastic, is a plastic material, a polymer, that becomes pliable or moldable above a specific temperature and solidifies upon cooling.

New!!: Integrated circuit packaging and Thermoplastic · See more »

Thermosetting polymer

A thermoset, also called a thermosetting plastic, is a plastic that is irreversibly cured from a soft solid or viscous liquid, prepolymer or resin.

New!!: Integrated circuit packaging and Thermosetting polymer · See more »

Thermosonic bonding

Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers.

New!!: Integrated circuit packaging and Thermosonic bonding · See more »

Thin Small Outline Package

Thin Small Outline Package, or TSOP is a type of surface mount IC package.

New!!: Integrated circuit packaging and Thin Small Outline Package · See more »

Three-dimensional integrated circuit

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.

New!!: Integrated circuit packaging and Three-dimensional integrated circuit · See more »

Very-large-scale integration

Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining hundreds of thousands of transistors or devices into a single chip.

New!!: Integrated circuit packaging and Very-large-scale integration · See more »

Wafer bonding

Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation.

New!!: Integrated circuit packaging and Wafer bonding · See more »

Wire bonding

Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.

New!!: Integrated circuit packaging and Wire bonding · See more »

Redirects here:

Area array package, Die attaching, Die attachment, IC encapsulation, IC packaging, Ic packaging, Integrated circuit encapsulation, Microelectronics packaging, Packaging (microfabrication), Semiconductor packaging.

References

[1] https://en.wikipedia.org/wiki/Integrated_circuit_packaging

OutgoingIncoming
Hey! We are on Facebook now! »