49 relations: Adhesive, Advanced Micro Devices, B-staging, Ball grid array, Chip carrier, Curing (chemistry), Die (integrated circuit), Dual in-line package, Electronic packaging, Epoxy, Eutectic system, Fin (extended surface), Flatpack (electronics), Flip chip, Gull wing, Integrated circuit, Integrated circuit packaging, Intel, Land grid array, Laser engraving, List of integrated circuit packaging types, McGraw-Hill Education, Microprocessor, Multi-chip module, Parasitic element (electrical networks), Pin grid array, Plating, Potting (electronics), Printed circuit board, Quad Flat Package, Quilt packaging, Semiconductor device fabrication, Semiconductor package, Small Outline Integrated Circuit, Solder, Solder ball, Surface-mount technology, System in package, Tape-automated bonding, Terminal (electronics), Thermal conduction, Thermoplastic, Thermosetting polymer, Thermosonic bonding, Thin Small Outline Package, Three-dimensional integrated circuit, Very-large-scale integration, Wafer bonding, Wire bonding.
An adhesive, also known as glue, cement, mucilage, or paste, is any substance applied to one surface, or both surfaces, of two separate items that binds them together and resists their separation.
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets.
B-staging is a process that utilizes heat or UV light to remove the majority of solvent from an adhesive, thereby allowing a construction to be “staged”.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").
Curing is a term in polymer chemistry and process engineering that refers to the toughening or hardening of a polymer material by cross-linking of polymer chains, brought about by electron beams, heat, or chemical additives.
A die (pronunciation: /daɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.
Electronic packaging is a major discipline within the field of electrical engineering and includes a wide variety of technologies.
Epoxy is either any of the basic components or the cured end products of epoxy resins, as well as a colloquial name for the epoxide functional group.
A eutectic system from the Greek "ευ" (eu.
In the study of heat transfer, fins are surfaces that extend from an object to increase the rate of heat transfer to or from the environment by increasing convection.
Flatpack is a US military standardized printed-circuit-board surface-mount-component package.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
The gull wing is an aircraft wing configuration with a prominent bend in the wing inner section towards the wing root.
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion.
Intel Corporation (stylized as intel) is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley.
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit.
Laser engraving, which is a subset of laser marking, is the practice of using lasers to engrave an object.
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
McGraw-Hill Education (MHE) is a learning science company and one of the "big three" educational publishers that provides customized educational content, software, and services for pre-K through postgraduate education.
A microprocessor is a computer processor that incorporates the functions of a central processing unit on a single integrated circuit (IC), or at most a few integrated circuits.
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC).
In electrical networks, a parasitic element is a circuit element (resistance, inductance or capacitance) that is possessed by an electrical component but which it is not desirable for it to have for its intended purpose.
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging.
Plating is a surface covering in which a metal is deposited on a conductive surface.
In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides.
Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect technology that incorporates conductive “nodules” fabricated on the sides of chips.
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices.
A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components.
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.
Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package).
Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits.
A terminal is the point at which a conductor from an electrical component, device or network comes to an end and provides a point of connection to external circuits.
Thermal conduction is the transfer of heat (internal energy) by microscopic collisions of particles and movement of electrons within a body.
A thermoplastic, or thermosoftening plastic, is a plastic material, a polymer, that becomes pliable or moldable above a specific temperature and solidifies upon cooling.
A thermoset, also called a thermosetting plastic, is a plastic that is irreversibly cured from a soft solid or viscous liquid, prepolymer or resin.
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers.
Thin Small Outline Package, or TSOP is a type of surface mount IC package.
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining hundreds of thousands of transistors or devices into a single chip.
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation.
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
Area array package, Die attaching, Die attachment, IC encapsulation, IC packaging, Ic packaging, Integrated circuit encapsulation, Microelectronics packaging, Packaging (microfabrication), Semiconductor packaging.