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19 relations: Alloy, Contact pad, Die (integrated circuit), Flux (metallurgy), Infrared heater, Intermetallic, Oxide, Printed circuit board, Reflow oven, Restriction of Hazardous Substances Directive, Solder, Solder paste, Surface-mount technology, Thermal equilibrium, Thermal profiling, Thermal shock, Through-hole technology, Wave soldering, Wetting.
Alloy
An alloy is a combination of metals or of a metal and another element.
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Contact pad
Contact pads or bond pads are designated surface areas of a printed circuit board or die of an integrated circuit.
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Die (integrated circuit)
A die (pronunciation: /daɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.
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Flux (metallurgy)
In metallurgy, a flux (derived from Latin fluxus meaning “flow”) is a chemical cleaning agent, flowing agent, or purifying agent.
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Infrared heater
An infrared heater or heat lamp is a body with a higher temperature which transfers energy to a body with a lower temperature through electromagnetic radiation.
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Intermetallic
An intermetallic (also called an intermetallic compound, intermetallic alloy, ordered intermetallic alloy, and a long-range-ordered alloy) is a solid-state compound exhibiting metallic bonding, defined stoichiometry and ordered crystal structure.
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Oxide
An oxide is a chemical compound that contains at least one oxygen atom and one other element in its chemical formula.
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Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
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Reflow oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB).
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Restriction of Hazardous Substances Directive
The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.
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Solder
Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.
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Solder paste
Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board.
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Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
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Thermal equilibrium
Two physical systems are in thermal equilibrium if there are no net flow of thermal energy between them when they are connected by a path permeable to heat.
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Thermal profiling
A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven).
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Thermal shock
Thermal shock occurs when a thermal gradient causes different parts of an object to expand by different amounts.
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Through-hole technology
Through-hole technology (tht), also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
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Wave soldering
Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards.
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Wetting
Wetting is the ability of a liquid to maintain contact with a solid surface, resulting from intermolecular interactions when the two are brought together.
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