178 relations: Alternating current, Aluminium, Aluminium oxide, Ammonium persulfate, Analog signature analysis, Antistatic bag, Automated optical inspection, Backplane, Bakelite, Ball grid array, Barcode, BoPET, Boundary scan, Breadboard, Breakdown voltage, BT-Epoxy, Capacitance, Certified Interconnect Designer, Characteristic impedance, Chemical milling, Common area, Comparison of EDA software, Composite epoxy material, Computer, Computer-aided design, Conductive ink, Conformal coating, Control Data Corporation, Copper, Copper pour, Coupon (PWB), Crosstalk, Cyanate ester, Design for manufacturability, Desoldering, Dielectric, Dielectric loss, Dip soldering, Drill bit, Dry transfer, Edge connector, Electrical conductor, Electrical resistance and conductance, Electricity, Electroless nickel immersion gold, Electromagnetic interference, Electronic component, Electronic design automation, Electronic packaging, Electronic waste, ..., Electroplating, Electrostatic discharge, Epoxy, Etching, European Union, Excellon format, Eye pattern, Fiberglass, Fibre-reinforced plastic, Fiducial marker, Fire retardant, Flexible electronics, Flying probe, FR-2, FR-4, Functional testing, Fuze, General Electric, Geoffrey Dummer, Gerber format, Glass transition, Gold plating, Ground (electricity), Ground plane, Heat sink, Home computer, Hot air solder leveling, Hybrid integrated circuit, IAg, IEEE Cledo Brunetti Award, Impedance matching, In-circuit test, Inductance, Insulator (electricity), Integrated circuit, IPC (electronics), Iron(III) chloride, JEDEC, John Sargrove, JTAG, Kapton, Lamination, Laser, Laser drilling, Lead, Lead (electronics), Leakage (electronics), List of EDA companies, Microscope, Microstrip, Microwave, Multi-chip module, Nickel, Numerical control, Occam process, Operating temperature, Ounce, Paul Eisler, Phase velocity, Phenol formaldehyde resin, Phenolic paper, Photoengraving, Photolithography, Photomask, Photoresist, Planar transmission line, Plating, Plotter, Point-to-point construction, Polyimide, Polytetrafluoroethylene, Power electronic substrate, Power-off testing, Printed circuit board, Printed circuit board milling, Printed electronic circuit, Printed electronics, Proximity fuze, Quality control, Radio, Reference designator, Reflow oven, Relative permittivity, Resin, Resistor, Restriction of Hazardous Substances Directive, Rework (electronics), Rigid needle adapter, Routing (electronic design automation), Royal Radar Establishment, Schematic capture, Screen printing, Serial code, Shear strength, Signal Corps (United States Army), Signal trace, SMT placement equipment, Solder, Solder mask, Soldering, Soldering iron, Sputter deposition, Square foot, Stripboard, Stripline, Substrate (electronics), Surface-mount technology, Thermal expansion, Thermosetting polymer, Thomas Edison, Through-hole technology, Tin, Tin pest, Transmission line, Tungsten carbide, Ultimate tensile strength, United States Army, University of Wisconsin–Madison, UPILEX, Veroboard, Via (electronics), Visual inspection, Wave soldering, Wax, Whisker (metallurgy), Wire wrap, World War II, 1N4148 signal diode. Expand index (128 more) » « Shrink index
Alternating current (AC) is an electric current which periodically reverses direction, in contrast to direct current (DC) which flows only in one direction.
Aluminium or aluminum is a chemical element with symbol Al and atomic number 13.
Aluminium oxide (British English) or aluminum oxide (American English) is a chemical compound of aluminium and oxygen with the chemical formula 23.
Ammonium persulfate (APS) is the inorganic compound with the formula (NH4)2S2O8.
Analog signature analysis is electronic component and circuit board troubleshooting technique which applies a current-limited AC sinewave across two points of an electronic component or circuit.
An antistatic bag is a bag used for storing electronic components, which are prone to damage caused by electrostatic discharge (ESD).
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).
A backplane (or "backplane system") is a group of electrical connectors in parallel with each other, so that each pin of each connector is linked to the same relative pin of all the other connectors, forming a computer bus.
Bakelite (sometimes spelled Baekelite), or polyoxybenzylmethylenglycolanhydride, is the first plastic made from synthetic components.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
A barcode (also bar code) is an optical, machine-readable, representation of data; the data usually describes something about the object that carries the barcode.
BoPET (biaxially-oriented polyethylene terephthalate) is a polyester film made from stretched polyethylene terephthalate (PET) and is used for its high tensile strength, chemical and dimensional stability, transparency, reflectivity, gas and aroma barrier properties, and electrical insulation.
Boundary scan is a method for testing interconnects (wire lines) on printed circuit boards or sub-blocks inside an integrated circuit.
A breadboard is a construction base for prototyping of electronics.
The breakdown voltage of an insulator is the minimum voltage that causes a portion of an insulator to become electrically conductive.
BT-Epoxy belongs to the group of thermoset resins used in printed circuit boards (PCBs).
Capacitance is the ratio of the change in an electric charge in a system to the corresponding change in its electric potential.
Certified Interconnect Designer (CID) is a certification from the IPC Designer's Council for experienced PCB design professionals.
The characteristic impedance or surge impedance (usually written Z0) of a uniform transmission line is the ratio of the amplitudes of voltage and current of a single wave propagating along the line; that is, a wave travelling in one direction in the absence of reflections in the other direction.
Chemical milling or industrial etching is the subtractive manufacturing process of using baths of temperature-regulated etching chemicals to remove material to create an object with the desired shape.
A common area is, in real estate or real property law, the "area which is available for use by more than one person..." The common areas are those that are available for common use by all tenants, groups of tenants and their invitees.
Comparison of Electronic design automation (EDA) software.
Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin.
A computer is a device that can be instructed to carry out sequences of arithmetic or logical operations automatically via computer programming.
Computer-aided design (CAD) is the use of computer systems to aid in the creation, modification, analysis, or optimization of a design.
Conductive ink is an ink that results in a printed object which conducts electricity.
Conformal coating material is a thin polymeric film which ‘conforms’ to the contours of a printed circuit board to protect the board's components.
Control Data Corporation (CDC) was a mainframe and supercomputer firm.
Copper is a chemical element with symbol Cu (from cuprum) and atomic number 29.
In electronics, the term copper pour refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards).
A coupon or test coupon is a printed circuit board (PCB) used to test the quality of a printed wiring board (PWB) fabrication process.
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel.
Cyanate esters are chemical substances in which the hydrogen atom of the phenolic OH group is substituted by a cyanide group.
Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture.
In electronics, desoldering is the removal of solder and components from a circuit board for troubleshooting, repair, replacement, and salvage.
A dielectric (or dielectric material) is an electrical insulator that can be polarized by an applied electric field.
Dielectric loss quantifies a dielectric material's inherent dissipation of electromagnetic energy (e.g. heat).
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly.
Drill bits are cutting tools used to remove material to create holes, almost always of circular cross-section.
Dry transfers (also called rub-ons or rubdowns) are decals that can be applied without the use of water or other solvent.
An edge connector is the portion of a printed circuit board (PCB) consisting of traces leading to the edge of the board that are intended to plug into a matching socket.
In physics and electrical engineering, a conductor is an object or type of material that allows the flow of an electrical current in one or more directions.
The electrical resistance of an electrical conductor is a measure of the difficulty to pass an electric current through that conductor.
Electricity is the set of physical phenomena associated with the presence and motion of electric charge.
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards.
Electromagnetic interference (EMI), also called radio-frequency interference (RFI) when in the radio frequency spectrum, is a disturbance generated by an external source that affects an electrical circuit by electromagnetic induction, electrostatic coupling, or conduction.
An electronic component is any basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields.
Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards.
Electronic packaging is a major discipline within the field of electrical engineering and includes a wide variety of technologies.
Electronic waste or e-waste describes discarded electrical or electronic devices.
Electroplating is a process that uses an electric current to reduce dissolved metal cations so that they form a thin coherent metal coating on an electrode.
Electrostatic discharge (ESD) is the sudden flow of electricity between two electrically charged objects caused by contact, an electrical short, or dielectric breakdown.
Epoxy is either any of the basic components or the cured end products of epoxy resins, as well as a colloquial name for the epoxide functional group.
Etching is traditionally the process of using strong acid or mordant to cut into the unprotected parts of a metal surface to create a design in intaglio (incised) in the metal.
The European Union (EU) is a political and economic union of EUnum member states that are located primarily in Europe.
The Excellon format is widely used to drive CNC drilling and routing machines in printed circuit board (PCB) manufacturing.
In telecommunication, an eye pattern, also known as an eye diagram, is an oscilloscope display in which a digital signal from a receiver is repetitively sampled and applied to the vertical input, while the data rate is used to trigger the horizontal sweep.
Fiberglass (US) or fibreglass (UK) is a common type of fiber-reinforced plastic using glass fiber.
Fibre-reinforced plastic (FRP) (also called fiber-reinforced polymer, or fiber-reinforced plastic) is a composite material made of a polymer matrix reinforced with fibres.
A fiducial marker or fiducial is an object placed in the field of view of an imaging system which appears in the image produced, for use as a point of reference or a measure.
A fire retardant is a substance that is used to slow or stop the spread of fire or reduce its intensity.
Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film.
In the testing of printed circuit boards, a flying probe test or fixtureless in-circuit test (FICT) system may be used for testing low to mid volume production, prototypes, and boards that present accessibility problems.
FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards.
FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material.
Functional testing is a quality assurance (QA) processPrasad, Dr.
In military munitions, a fuze (sometimes fuse) is the part of the device that initiates function.
General Electric Company (GE) is an American multinational conglomerate incorporated in New York and headquartered in Boston, Massachusetts.
*Not to be confused with serial killer Jeffrey Dahmer. Geoffrey William Arnold Dummer, MBE (1945), C.Eng., IEE Premium Award, FIEEE, MIEE, USA Medal of Freedom with Bronze Palm (25 February 1909 – 9 September 2002) was an English electronics engineer and consultant who is credited as being the first person to conceptualise and build a prototype of the integrated circuit, commonly called the microchip, in the late-1940s and early 1950s.
The Gerber format is an open ASCII vector format for 2D binary images.
The glass–liquid transition, or glass transition, is the gradual and reversible transition in amorphous materials (or in amorphous regions within semicrystalline materials), from a hard and relatively brittle "glassy" state into a viscous or rubbery state as the temperature is increased.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by chemical or electrochemical plating.
In electrical engineering, ground or earth is the reference point in an electrical circuit from which voltages are measured, a common return path for electric current, or a direct physical connection to the earth.
In electrical engineering, a ground plane is an electrically conductive surface, usually connected to electrical ground.
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels.
Home computers were a class of microcomputers entering the market in 1977, and becoming common during the 1980s.
HASL or hot air solder leveling is a type of finish used on printed circuit boards (PCBs).
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes andor monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB).
IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.
The IEEE Cledo Brunetti Award is an award is presented for outstanding contributions to nanotechnology and miniaturization in the electronics arts.
In electronics, impedance matching is the practice of designing the input impedance of an electrical load or the output impedance of its corresponding signal source to maximize the power transfer or minimize signal reflection from the load.
In-circuit test (ICT) is an example of white box testing where an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated.
In electromagnetism and electronics, inductance is the property of an electrical conductor by which a change in electric current through it induces an electromotive force (voltage) in the conductor.
An electrical insulator is a material whose internal electric charges do not flow freely; very little electric current will flow through it under the influence of an electric field.
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
IPC, the Association Connecting Electronics Industries, is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies.
Iron(III) chloride, also called ferric chloride, is an industrial scale commodity chemical compound, with the formula FeCl3 and with iron in the +3 oxidation state.
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.
John Sargrove (1906–1974) was a British engineer and automation pioneer.
JTAG (named after the Joint Test Action Group which codified it) is an industry standard for verifying designs and testing printed circuit boards after manufacture.
Kapton is a polyimide film developed by DuPont in the late 1960s that remains stable across a wide range of temperatures, from.
Lamination is the technique of manufacturing a material in multiple layers, so that the composite material achieves improved strength, stability, sound insulation, appearance or other properties from the use of differing materials.
A laser is a device that emits light through a process of optical amplification based on the stimulated emission of electromagnetic radiation.
Laser drilling is the process of creating thru-holes, referred to as “popped” holes or “percussion drilled” holes, by repeatedly pulsing focused laser energy on a material.
Lead is a chemical element with symbol Pb (from the Latin plumbum) and atomic number 82.
In electronics, a lead is an electrical connection consisting of a length of wire or a metal pad (SMD) that is designed to connect two locations electrically.
In electronics, leakage may refer to a gradual loss of energy from a charged capacitor.
A list of electronic design automation (EDA) companies.
A microscope (from the μικρός, mikrós, "small" and σκοπεῖν, skopeîn, "to look" or "see") is an instrument used to see objects that are too small to be seen by the naked eye.
Microstrip is a type of electrical transmission line which can be fabricated using printed circuit board technology, and is used to convey microwave-frequency signals.
Microwaves are a form of electromagnetic radiation with wavelengths ranging from one meter to one millimeter; with frequencies between and.
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC).
Nickel is a chemical element with symbol Ni and atomic number 28.
Computer numerical control (CNC) is the automation of machine tools by means of computers executing pre-programmed sequences of machine control commands.
The Occam process is a solder-free, Restriction of Hazardous Substances Directive (RoHS)-compliant method for use in the manufacturing of electronic circuit boards developed by Verdant Electronics.
An operating temperature is the temperature at which an electrical or mechanical device operates.
The ounce (abbreviated oz; apothecary symbol: ℥) is a unit of mass, weight, or volume used in most British derived customary systems of measurement.
Paul Eisler (1907 – 26 October 1992, London) was an Austrian inventor born in Vienna.
The phase velocity of a wave is the rate at which the phase of the wave propagates in space.
Phenol formaldehyde resins (PF) or phenolic resins are synthetic polymers obtained by the reaction of phenol or substituted phenol with formaldehyde.
Phenolic paper is a material often used to make printed circuit board substrates (the flat board to which the components and traces are attached).
Photoengraving is a process that uses a light-sensitive photoresist applied to the surface to be engraved to create a mask that shields some areas during a subsequent operation which etches, dissolves, or otherwise removes some or all of the material from the unshielded areas.
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate.
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern.
A photoresist is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface.
Planar transmission lines are transmission lines with conductors, or in some cases dielectric strips, that are flat, ribbon-shaped lines.
Plating is a surface covering in which a metal is deposited on a conductive surface.
The plotter is a computer printer for printing vector graphics.
Point-to-point construction is a non-automated method of construction of electronics circuits widely used before the use of printed circuit boards (PCBs) and automated assembly gradually became widespread following their introduction in the 1950s.
Polyimide (sometimes abbreviated PI) is a polymer of imide monomers.
Polytetrafluoroethylene (PTFE) is a synthetic fluoropolymer of tetrafluoroethylene that has numerous applications.
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.
Power-off testing is often necessary to test the printed circuit assembly (PCA) board due to uncertainty as to the nature of the failure.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
Printed circuit board milling (also: isolation milling) is the process of removing areas of copper from a sheet of printed circuit board material to recreate the pads, signal traces and structures according to patterns from a digital circuit board plan known as a layout file.
A printed electronic circuit (PEC) was an ancestor of the hybrid integrated circuit (IC).
Printed electronics is a set of printing methods used to create electrical devices on various substrates.
A proximity fuze is a fuze that detonates an explosive device automatically when the distance to the target becomes smaller than a predetermined value.
Quality control, or QC for short, is a process by which entities review the quality of all factors involved in production.
Radio is the technology of using radio waves to carry information, such as sound, by systematically modulating properties of electromagnetic energy waves transmitted through space, such as their amplitude, frequency, phase, or pulse width.
A reference designator unambiguously identifies a component in an electrical schematic or on a printed circuit board.
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB).
The relative permittivity of a material is its (absolute) permittivity expressed as a ratio relative to the permittivity of vacuum.
In polymer chemistry and materials science, resin is a "solid or highly viscous substance" of plant or synthetic origin that is typically convertible into polymers.
A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element.
The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.
Rework (or re-work) is the term for the refinishing operation or repair of an electronic printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD).
A rigid needle adapter enables electrical contact of finest structures on printed and assembled circuit boards, and also direct contact in fine-pole connectors.
In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs).
The Royal Radar Establishment is a research center in Malvern, Worcestershire in the United Kingdom.
Schematic capture or schematic entry is a step in the design cycle of electronic design automation (EDA) at which the electronic diagram, or electronic schematic of the designed electronic circuit is created by a designer.
Screen printing is a printing technique whereby a mesh is used to transfer ink onto a substrate, except in areas made impermeable to the ink by a blocking stencil.
A serial code is a unique identifier assigned incrementally or sequentially to an item.
In engineering, shear strength is the strength of a material or component against the type of yield or structural failure where the material or component fails in shear.
The United States Army Signal Corps (USASC) develops, tests, provides, and manages communications and information systems support for the command and control of combined arms forces.
In electronics, a signal trace on a printed circuit board (PCB) is the equivalent of a wire for conducting signals.
SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB).
Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.
Solder mask or solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
Soldering (AmE:, BrE), is a process in which two or more items (usually metal) are joined together by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal.
A soldering iron is a hand tool used in soldering.
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering.
The square foot (plural square feet; abbreviated sq ft, sf, ft2) is an imperial unit and U.S. customary unit (non-SI, non-metric) of area, used mainly in the United States and partially in Bangladesh, Canada, Ghana, Hong Kong, India, Malaysia, Nepal, Pakistan, Singapore and the United Kingdom.
Stripboard is the generic name for a widely used type of electronics prototyping board characterized by a 0.1 inch (2.54 mm) regular (rectangular) grid of holes, with wide parallel strips of copper cladding running in one direction all the way across one side of the board.
Stripline is a transverse electromagnetic (TEM) transmission line medium invented by Robert M. Barrett of the Air Force Cambridge Research Centre in the 1950s.
A substrate (also called a wafer) is a solid (usually planar) substance onto which a layer of another substance is applied, and to which that second substance adheres.
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
Thermal expansion is the tendency of matter to change in shape, area, and volume in response to a change in temperature.
A thermoset, also called a thermosetting plastic, is a plastic that is irreversibly cured from a soft solid or viscous liquid, prepolymer or resin.
Thomas Alva Edison (February 11, 1847October 18, 1931) was an American inventor and businessman, who has been described as America's greatest inventor.
Through-hole technology (tht), also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Tin is a chemical element with the symbol Sn (from stannum) and atomic number 50.
Tin pest is an autocatalytic, allotropic transformation of the element tin, which causes deterioration of tin objects at low temperatures.
In communications and electronic engineering, a transmission line is a specialized cable or other structure designed to conduct alternating current of radio frequency, that is, currents with a frequency high enough that their wave nature must be taken into account.
Tungsten carbide (chemical formula: WC) is a chemical compound (specifically, a carbide) containing equal parts of tungsten and carbon atoms.
Ultimate tensile strength (UTS), often shortened to tensile strength (TS), ultimate strength, or Ftu within equations, is the capacity of a material or structure to withstand loads tending to elongate, as opposed to compressive strength, which withstands loads tending to reduce size.
The United States Army (USA) is the land warfare service branch of the United States Armed Forces.
The University of Wisconsin–Madison (also known as University of Wisconsin, Wisconsin, UW, or regionally as UW–Madison, or simply Madison) is a public research university in Madison, Wisconsin, United States.
Upilex is a heat-resistant polyimide film that is the product of the polycondensation reaction between biphenyl tetracarboxylic dianhydride (BPDA) monomers and diamine.
Veroboard is a brand of stripboard, a pre-formed circuit board material of copper strips on an insulating bonded paper board which was originated and developed in the early 1960s by the Electronics Department of Vero Precision Engineering Ltd (VPE).
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic circuit that goes through the plane of one or more adjacent layers.
Visual inspection is a common method of quality control, data acquisition, and data analysis.
Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards.
Waxes are a diverse class of organic compounds that are lipophilic, malleable solids near ambient temperatures.
Metal whiskering is a phenomenon which occurs in electrical devices when metals form long whisker-like projections over time.
Wire wrap was invented to wire telephone crossbar switches, and later adapted to construct electronic circuit boards.
World War II (often abbreviated to WWII or WW2), also known as the Second World War, was a global war that lasted from 1939 to 1945, although conflicts reflecting the ideological clash between what would become the Allied and Axis blocs began earlier.
The 1N4148 is a standard silicon switching signal diode.
20-h, Breakout board, Circuit Board, Circuit Card Assembly, Circuit board, Circuit boards, Circuit card assembly, Circuitboard, Circuitboards, Conductive trace, Copper-clad laminates, Etched circuit, Heavy Copper, Heavy copper, Insertion Mount Technology, Insertion mount technology, Miniature PCB, Multi-panel (PCB), Multi-panel (PWB), Multi-panel (electronics), Multipanel (PCB), Multipanel (PWB), Multipanel (electronics), PC board, PCB (electronics), PCB Assembly, PCB CAM, PCB assembler, PCB assembling, PCB assembly, PCB assembly shop, PCB assembly vendor, PCB design, PCB designer, PCB fabrication, PCB fabricator, PCB layout, PCB manufacturer, PCB manufacturing, PCB multi-panel, PCB multipanel, PCB panel, PCB panelization, PCB trace, PCB traces, PWB (electronics), PWB multi-panel, PWB multipanel, PWB panel, PWB panelization, Panel (electronics), Panelization (PCB), Panelization (PWB), Panelization (electronics), Pcb design, Power Plane, Power plane, Printed Circuit Board, Printed Circuit Board Assembly, Printed Circuit Boards, Printed Circuit Design, Printed Circuits, Printed circuit, Printed circuit assembly, Printed circuit board assembly, Printed circuit board design, Printed circuit boards, Printed circuits, Printed wiring board, Printed wiring boards, Printed-Circuit Board, Printed-circuit Board, Printed-circuit board, Rigid PCB, Rigid RWB, Rigid board, Rigid printed circuit board, Rigid printed wiring board, Signal traces, Through-holes.