34 relations: Ball grid array, Chip carrier, Chip-scale package, Copper conductor, Deformation (mechanics), Electronics, Finite element method, Integrated circuit, IPC (electronics), JEDEC, Lead frame, List of integrated circuit packaging types, Microchip Technology, Moisture sensitivity level, National Semiconductor, Original equipment manufacturer, Printed circuit board, Quad Flat No-leads package, Quad Flat Package, Reflow soldering, Shear stress, Small Outline Integrated Circuit, Solder, Solder fatigue, Solder mask, Surface-mount technology, Temperature cycling, Texas Instruments, Thermal expansion, Thousandth of an inch, Through-hole technology, Via (electronics), Weibull, Wire bonding.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Copper has been used in electrical wiring since the invention of the electromagnet and the telegraph in the 1820s.
Deformation in continuum mechanics is the transformation of a body from a reference configuration to a current configuration.
Electronics is the discipline dealing with the development and application of devices and systems involving the flow of electrons in a vacuum, in gaseous media, and in semiconductors.
The finite element method (FEM), is a numerical method for solving problems of engineering and mathematical physics.
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
IPC, the Association Connecting Electronics Industries, is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies.
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.
Lead frames are the metal structures inside a chip package that carry signals from the die to the outside.
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
Microchip Technology is an American manufacturer of microcontroller, memory and analog semiconductors.
Moisture sensitivity level relates to the packaging and handling precautions for some semiconductors.
National Semiconductor was an American semiconductor manufacturer which specialized in analog devices and subsystems, formerly with headquarters in Santa Clara, California, United States.
An Original Equipment Manufacturer (OEM) is a company that produces parts and equipment that may be marketed by another manufacturer.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards.
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides.
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint.
A shear stress, often denoted by (Greek: tau), is the component of stress coplanar with a material cross section.
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.
Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading.
Solder mask or solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
Temperature cycling (or temperature cycle) is the process of cycling through two temperature extremes, typically at relatively high rates of change.
Texas Instruments Inc. (TI) is an American technology company that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally.
Thermal expansion is the tendency of matter to change in shape, area, and volume in response to a change in temperature.
A thousandth of an inch is a derived unit of length in an inch-based system of units.
Through-hole technology (tht), also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic circuit that goes through the plane of one or more adjacent layers.
Weibull is a Swedish locational surname.
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
Dual Flat No Lead, Dual Flat No leads, Dual Flat No-leads package, Dual flat no leads, HVQFN, LQFN, Micro Leadframe Package, MicroLeadFrame, QFN, Quad Flat No leads package, Quad flat no leads package, Quad-flat no-leads package, VQFN.