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102 relations: Adhesive, Albedo, Analog Devices, Automated optical inspection, AVX Corporation, Ball grid array, Board-to-board connector, Breadboard, Capacitor, Chip carrier, Conformal coating, Convection, Copper, Diode, Diodes Incorporated, DO-214, Electrolytic capacitor, Electromagnetic compatibility, Electronic Industries Association of Japan, Electronic packaging, Electronics, Electronics manufacturing services, Elsevier, Epoxy, Fairchild Semiconductor, Film capacitor, Flash point, Flatpack (electronics), Flexible electronics, Fluorocarbon, Flux (metallurgy), Hydrocarbon, IBM, In-circuit test, Infrared, Inkjet printing, Intersil, IPC (electronics), IXYS Corporation, JEDEC, John Wiley & Sons, KEMET Corporation, Land grid array, Lead (electronics), Letter and digit code, Limonene, Linear Technology, Liquid-crystal display, List of integrated circuit packaging types, Littelfuse, ..., Logo, Metal electrode leadless face, Motorola, Murata Manufacturing, Nippon Chemi-Con, Nitrogen, Numerical control, NXP Semiconductors, ON Semiconductor, Panasonic, Point-to-point construction, Potting (electronics), Power factor, Printed circuit board, Purified water, Quad Flat No-leads package, Quad Flat Package, Reflow oven, Reflow soldering, Resistor, Restriction of Hazardous Substances Directive, Ricoh, Rohm, Rosin, Saturn IB, Saturn Launch Vehicle Digital Computer, Saturn V, Saturn V Instrument Unit, Screen printing, Selective soldering, Silicon, Small Outline Integrated Circuit, Small-outline transistor, SMT placement equipment, Solder ball, Solder paste, Soldering iron, Stripboard, Surface tension, Tantalum capacitor, Thermal conductivity, Thin Small Outline Package, Through-hole technology, Tin, TO-220, TO-263, Transformer, Vishay Intertechnology, Wave soldering, Wire bonding, Wire wrap, Zetex Semiconductors. Expand index (52 more) »
Adhesive
An adhesive, also known as glue, cement, mucilage, or paste, is any substance applied to one surface, or both surfaces, of two separate items that binds them together and resists their separation.
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Albedo
Albedo (albedo, meaning "whiteness") is the measure of the diffuse reflection of solar radiation out of the total solar radiation received by an astronomical body (e.g. a planet like Earth).
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Analog Devices
Analog Devices, Inc., also known as ADI or Analog, is an American multinational semiconductor company specializing in data conversion and signal processing technology, headquartered in Norwood, Massachusetts.
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Automated optical inspection
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).
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AVX Corporation
AVX Corporation, is an American manufacturer of electronic components headquartered in Fountain Inn, South Carolina.
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Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
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Board-to-board connector
Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner.
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Breadboard
A breadboard is a construction base for prototyping of electronics.
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Capacitor
A capacitor is a passive two-terminal electrical component that stores potential energy in an electric field.
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Chip carrier
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").
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Conformal coating
Conformal coating material is a thin polymeric film which ‘conforms’ to the contours of a printed circuit board to protect the board's components.
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Convection
Convection is the heat transfer due to bulk movement of molecules within fluids such as gases and liquids, including molten rock (rheid).
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Copper
Copper is a chemical element with symbol Cu (from cuprum) and atomic number 29.
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Diode
A diode is a two-terminal electronic component that conducts current primarily in one direction (asymmetric conductance); it has low (ideally zero) resistance in one direction, and high (ideally infinite) resistance in the other.
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Diodes Incorporated
Diodes Incorporated is an American manufacturer and supplier of discrete, logic, analog and mixed-signal semiconductors.
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DO-214
DO-214 is a standard that specifies a group of semiconductor packages for surface mounted diodes.
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Electrolytic capacitor
An electrolytic capacitor (e-cap) is a polarized capacitor whose anode or positive plate is made of a metal that forms an insulating oxide layer through anodization.
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Electromagnetic compatibility
Electromagnetic compatibility (EMC) is the branch of electrical engineering concerned with the unintentional generation, propagation and reception of electromagnetic energy which may cause unwanted effects such as electromagnetic interference (EMI) or even physical damage in operational equipment.
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Electronic Industries Association of Japan
Founded in 1948, the Electronic Industries Association of Japan (EIAJ) was one of two Japanese electronics trade organizations that were merged into the Japan Electronics and Information Technology Industries Association (JEITA).
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Electronic packaging
Electronic packaging is a major discipline within the field of electrical engineering and includes a wide variety of technologies.
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Electronics
Electronics is the discipline dealing with the development and application of devices and systems involving the flow of electrons in a vacuum, in gaseous media, and in semiconductors.
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Electronics manufacturing services
Electronics manufacturing services (EMS) is a term used for companies that design, manufacture, test, distribute, and provide return/repair services for electronic components and assemblies for original equipment manufacturers (OEMs).
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Elsevier
Elsevier is an information and analytics company and one of the world's major providers of scientific, technical, and medical information.
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Epoxy
Epoxy is either any of the basic components or the cured end products of epoxy resins, as well as a colloquial name for the epoxide functional group.
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Fairchild Semiconductor
Fairchild Semiconductor International, Inc. was an American semiconductor company based in San Jose, California.
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Film capacitor
Film capacitors, plastic film capacitors, film dielectric capacitors, or polymer film capacitors, generically called “film caps” as well as power film capacitors, are electrical capacitors with an insulating plastic film as the dielectric, sometimes combined with paper as carrier of the electrodes.
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Flash point
The flash point of a volatile material is the lowest temperature at which vapours of the material will ignite, when given an ignition source.
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Flatpack (electronics)
Flatpack is a US military standardized printed-circuit-board surface-mount-component package.
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Flexible electronics
Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film.
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Fluorocarbon
Fluorocarbons, sometimes referred to as perfluorocarbons or PFCs, are, strictly speaking, organofluorine compounds with the formula CxFy, i.e. they contain only carbon and fluorine, though the terminology is not strictly followed.
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Flux (metallurgy)
In metallurgy, a flux (derived from Latin fluxus meaning “flow”) is a chemical cleaning agent, flowing agent, or purifying agent.
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Hydrocarbon
In organic chemistry, a hydrocarbon is an organic compound consisting entirely of hydrogen and carbon.
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IBM
The International Business Machines Corporation (IBM) is an American multinational technology company headquartered in Armonk, New York, United States, with operations in over 170 countries.
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In-circuit test
In-circuit test (ICT) is an example of white box testing where an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated.
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Infrared
Infrared radiation (IR) is electromagnetic radiation (EMR) with longer wavelengths than those of visible light, and is therefore generally invisible to the human eye (although IR at wavelengths up to 1050 nm from specially pulsed lasers can be seen by humans under certain conditions). It is sometimes called infrared light.
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Inkjet printing
Inkjet printing is a type of computer printing that recreates a digital image by propelling droplets of ink onto paper, plastic, or other substrates.
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Intersil
Intersil is an American semiconductor company headquartered in Milpitas, California.
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IPC (electronics)
IPC, the Association Connecting Electronics Industries, is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies.
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IXYS Corporation
IXYS Corporation, (NASDAQ) is an American company based in Milpitas, California.
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JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.
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John Wiley & Sons
John Wiley & Sons, Inc., also referred to as Wiley, is a global publishing company that specializes in academic publishing.
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KEMET Corporation
KEMET Corporation was set up in 1919 and now is based in Simpsonville, South Carolina.
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Land grid array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit.
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Lead (electronics)
In electronics, a lead is an electrical connection consisting of a length of wire or a metal pad (SMD) that is designed to connect two locations electrically.
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Letter and digit code
The letter and digit code for resistance and capacitance values and tolerances, which is also known as RKM code or "R notation", is a notation to specify resistor and capacitor values defined in the international standard IEC 60062 (formerly IEC 62) since 1952.
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Limonene
Limonene is a clear, colorless liquid hydrocarbon classified as a cyclic monoterpene, and is the major component in the oil of citrus fruit peels.
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Linear Technology
Linear Technology Corporation designs, manufactures and markets a broad line of standard high performance analog integrated circuits.
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Liquid-crystal display
A liquid-crystal display (LCD) is a flat-panel display or other electronically modulated optical device that uses the light-modulating properties of liquid crystals.
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List of integrated circuit packaging types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
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Littelfuse
Littelfuse, Inc is a multinational electronic manufacturing company based in Chicago, Illinois.
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Logo
A logo (abbreviation of logotype, from λόγος logos "word" and τύπος typos "imprint") is a graphic mark, emblem, or symbol used to aid and promote public identification and recognition.
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Metal electrode leadless face
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device that is metallized at its ends.
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Motorola
Motorola, Inc. was an American multinational telecommunications company founded on September 25, 1928, based in Schaumburg, Illinois.
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Murata Manufacturing
is a Japanese manufacturer of electronic components, based in Nagaokakyo, Kyoto.
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Nippon Chemi-Con
is a Japanese corporation that produces capacitors and other discrete electronic components.
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Nitrogen
Nitrogen is a chemical element with symbol N and atomic number 7.
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Numerical control
Computer numerical control (CNC) is the automation of machine tools by means of computers executing pre-programmed sequences of machine control commands.
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NXP Semiconductors
NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands.
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ON Semiconductor
ON Semiconductor is a Fortune 500 semiconductors supplier company.
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Panasonic
, formerly known as, is a Japanese multinational electronics corporation headquartered in Kadoma, Osaka, Japan.
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Point-to-point construction
Point-to-point construction is a non-automated method of construction of electronics circuits widely used before the use of printed circuit boards (PCBs) and automated assembly gradually became widespread following their introduction in the 1950s.
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Potting (electronics)
In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents.
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Power factor
In electrical engineering, the power factor of an AC electrical power system is defined as the ratio of the real power flowing to the load to the apparent power in the circuit, and is a dimensionless number in the closed interval of −1 to 1.
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Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
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Purified water
Purified water is water that has been mechanically filtered or processed to remove impurities and make it suitable for use.
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Quad Flat No-leads package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards.
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Quad Flat Package
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides.
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Reflow oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB).
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Reflow soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint.
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Resistor
A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element.
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Restriction of Hazardous Substances Directive
The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.
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Ricoh
is a Japanese multinational imaging and electronics company.
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Rohm
is a Japanese electronic parts manufacturer based in Kyoto, Japan.
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Rosin
Rosin, also called colophony or Greek pitch (pix græca), is a solid form of resin obtained from pines and some other plants, mostly conifers, produced by heating fresh liquid resin to vaporize the volatile liquid terpene components.
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Saturn IB
The Saturn IB (pronounced "one B", also known as the Uprated Saturn I) was an American launch vehicle commissioned by the National Aeronautics and Space Administration (NASA) for the Apollo program.
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Saturn Launch Vehicle Digital Computer
The Saturn Launch Vehicle Digital Computer (LVDC) was a computer that provided the autopilot for the Saturn V rocket from launch to Earth orbit insertion.
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Saturn V
The Saturn V (pronounced "Saturn five") was an American human-rated expendable rocket used by NASA between 1967 and 1973.
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Saturn V Instrument Unit
The Saturn V Instrument Unit is a ring-shaped structure fitted to the top of the Saturn V rocket's third stage (S-IVB) and the Saturn IB's second stage (also an S-IVB).
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Screen printing
Screen printing is a printing technique whereby a mesh is used to transfer ink onto a substrate, except in areas made impermeable to the ink by a blocking stencil.
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Selective soldering
Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or Through-hole technology assembly processes.This usually follows an SMT oven reflow process; parts to be selectively soldered are usually surrounded by parts that have been previously soldered in a surface-mount reflow process, and the selective-solder process must be sufficiently precise to avoid damaging them.
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Silicon
Silicon is a chemical element with symbol Si and atomic number 14.
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Small Outline Integrated Circuit
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.
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Small-outline transistor
A small outline transistor (SOT) is a small footprint, discrete surface mount transistor commonly used in consumer electronics.
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SMT placement equipment
SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB).
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Solder ball
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.
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Solder paste
Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board.
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Soldering iron
A soldering iron is a hand tool used in soldering.
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Stripboard
Stripboard is the generic name for a widely used type of electronics prototyping board characterized by a 0.1 inch (2.54 mm) regular (rectangular) grid of holes, with wide parallel strips of copper cladding running in one direction all the way across one side of the board.
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Surface tension
Surface tension is the elastic tendency of a fluid surface which makes it acquire the least surface area possible.
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Tantalum capacitor
A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits.
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Thermal conductivity
Thermal conductivity (often denoted k, λ, or κ) is the property of a material to conduct heat.
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Thin Small Outline Package
Thin Small Outline Package, or TSOP is a type of surface mount IC package.
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Through-hole technology
Through-hole technology (tht), also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
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Tin
Tin is a chemical element with the symbol Sn (from stannum) and atomic number 50.
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TO-220
The TO-220 is a style of electronic component package, commonly used for discrete semiconductors as transistors and silicon-controlled rectifiers, as well as integrated circuits.
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TO-263
The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards.
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Transformer
A transformer is a static electrical device that transfers electrical energy between two or more circuits through electromagnetic induction.
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Vishay Intertechnology
Vishay Intertechnology, Inc. is an American manufacturer of discrete semiconductors and passive electronic component founded by Polish-born businessman Felix Zandman.
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Wave soldering
Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards.
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Wire bonding
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
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Wire wrap
Wire wrap was invented to wire telephone crossbar switches, and later adapted to construct electronic circuit boards.
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Zetex Semiconductors
Zetex Semiconductors plc is a UK-based manufacturer of discrete semiconductor devices such as diodes and transistors.
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References
[1] https://en.wikipedia.org/wiki/Surface-mount_technology
