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Three-dimensional integrated circuit

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In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. [1]

52 relations: Bandwidth (signal processing), Bus (computing), Central processing unit, CMOS, Computer-aided design, DARPA, DDR4 SDRAM, Design for testing, Die (integrated circuit), Dynamic random-access memory, Electric energy consumption, Electrical connection, Electronic component, Electronics, Firewall (computing), Flip chip, Georgia Institute of Technology, High Bandwidth Memory, Hybrid Memory Cube, Integrated circuit, Intel, International Technology Roadmap for Semiconductors, Interposer, JEDEC, Microelectronics, Moore's law, Netlist, Original equipment manufacturer, Package on package, Parasitic capacitance, Pentium 4, Place and route, Process variation (semiconductor), Random-access memory, Redistribution layer, Reverse engineering, Security through obscurity, Semiconductor intellectual property core, Semiconductor memory, Silicon on insulator, Stanford University, Static random-access memory, System in package, System monitor, Teraflops Research Chip, Through-silicon via, University of Michigan, University of Rochester, Wafer (electronics), Wafer dicing, ..., Wafer-level packaging, Wire bonding. Expand index (2 more) »

Bandwidth (signal processing)

Bandwidth is the difference between the upper and lower frequencies in a continuous band of frequencies.

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Bus (computing)

In computer architecture, a bus (a contraction of the Latin omnibus) is a communication system that transfers data between components inside a computer, or between computers.

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Central processing unit

A central processing unit (CPU) is the electronic circuitry within a computer that carries out the instructions of a computer program by performing the basic arithmetic, logical, control and input/output (I/O) operations specified by the instructions.

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CMOS

Complementary metal–oxide–semiconductor, abbreviated as CMOS, is a technology for constructing integrated circuits.

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Computer-aided design

Computer-aided design (CAD) is the use of computer systems to aid in the creation, modification, analysis, or optimization of a design.

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DARPA

The Defense Advanced Research Projects Agency (DARPA) is an agency of the United States Department of Defense responsible for the development of emerging technologies for use by the military.

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DDR4 SDRAM

In computing, DDR4 SDRAM, an abbreviation for double data rate fourth-generation synchronous dynamic random-access memory, is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth ("double data rate") interface.

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Design for testing

Design for testing or design for testability (DFT) consists of IC design techniques that add testability features to a hardware product design.

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Die (integrated circuit)

A die (pronunciation: /daɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.

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Dynamic random-access memory

Dynamic random-access memory (DRAM) is a type of random access semiconductor memory that stores each bit of data in a separate tiny capacitor within an integrated circuit.

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Electric energy consumption

Electric energy consumption is the form of energy consumption that uses electric energy.

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Electrical connection

An electrical connection between discrete points allows the flow of electrons (electric current).

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Electronic component

An electronic component is any basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields.

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Electronics

Electronics is the discipline dealing with the development and application of devices and systems involving the flow of electrons in a vacuum, in gaseous media, and in semiconductors.

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Firewall (computing)

In computing, a firewall is a network security system that monitors and controls incoming and outgoing network traffic based on predetermined security rules.

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Flip chip

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

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Georgia Institute of Technology

The Georgia Institute of Technology, commonly referred to as Georgia Tech, is a public research university and institute of technology in Atlanta, Georgia.

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High Bandwidth Memory

High Bandwidth Memory (HBM) is a high-performance RAM interface for 3D-stacked DRAM from AMD and Hynix.

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Hybrid Memory Cube

Hybrid Memory Cube (HMC) is a high-performance RAM interface for through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM).

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Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.

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Intel

Intel Corporation (stylized as intel) is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley.

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International Technology Roadmap for Semiconductors

The International Technology Roadmap for Semiconductors (ITRS) is a set of documents produced by a group of semiconductor industry experts.

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Interposer

An interposer is an electrical interface routing between one socket or connection to another.

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JEDEC

The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.

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Microelectronics

Microelectronics is a subfield of electronics.

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Moore's law

Moore's law is the observation that the number of transistors in a dense integrated circuit doubles about every two years.

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Netlist

In electronic design, a netlist is a description of the connectivity of an electronic circuit.

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Original equipment manufacturer

An Original Equipment Manufacturer (OEM) is a company that produces parts and equipment that may be marketed by another manufacturer.

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Package on package

Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages.

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Parasitic capacitance

Parasitic capacitance, or stray capacitance is an unavoidable and usually unwanted capacitance that exists between the parts of an electronic component or circuit simply because of their proximity to each other.

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Pentium 4

Pentium 4 is a brand by Intel for an entire series of single-core CPUs for desktops, laptops and entry-level servers.

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Place and route

Place and route is a stage in the design of printed circuit boards, integrated circuits, and field-programmable gate arrays.

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Process variation (semiconductor)

Process variation is the naturally occurring variation in the attributes of transistors (length, widths, oxide thickness) when integrated circuits are fabricated.

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Random-access memory

Random-access memory (RAM) is a form of computer data storage that stores data and machine code currently being used.

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Redistribution layer

A redistribution layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations.

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Reverse engineering

Reverse engineering, also called back engineering, is the process by which a man-made object is deconstructed to reveal its designs, architecture, or to extract knowledge from the object; similar to scientific research, the only difference being that scientific research is about a natural phenomenon.

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Security through obscurity

In security engineering, security through obscurity (or security by obscurity) is the reliance on the secrecy of the design or implementation as the main method of providing security for a system or component of a system.

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Semiconductor intellectual property core

In electronic design a semiconductor intellectual property core, IP core, or IP block is a reusable unit of logic, cell, or integrated circuit (commonly called a "chip") layout design that is the intellectual property of one party.

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Semiconductor memory

Semiconductor memory is a digital electronic data storage device, often used as computer memory, implemented with semiconductor electronic devices on an integrated circuit (IC).

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Silicon on insulator

Silicon on insulator (SOI) technology refers to the use of a layered silicon–insulator–silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance, thereby improving performance.

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Stanford University

Stanford University (officially Leland Stanford Junior University, colloquially the Farm) is a private research university in Stanford, California.

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Static random-access memory

Static random-access memory (static RAM or SRAM) is a type of semiconductor memory that uses bistable latching circuitry (flip-flop) to store each bit.

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System in package

A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package).

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System monitor

A system monitor is a hardware or software component used to monitor resources and performance in a computer system.

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Teraflops Research Chip

The Teraflops Research Chip (also called Polaris) is a research manycore processor, containing 80 cores developed by Intel Corporation's Tera-Scale Computing Research Program.

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Through-silicon via

In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die.

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University of Michigan

The University of Michigan (UM, U-M, U of M, or UMich), often simply referred to as Michigan, is a public research university in Ann Arbor, Michigan.

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University of Rochester

The University of Rochester (U of R or UR) frequently referred to as Rochester, is a private research university in Rochester, New York.

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Wafer (electronics)

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

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Wafer dicing

In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer.

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Wafer-level packaging

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.

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Wire bonding

Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.

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References

[1] https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit

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