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7 relations: Electrostatic discharge, Heat sink, Hot swapping, M.2, Serial ATA, Serial Attached SCSI, Thermal design power.
Electrostatic discharge
Electrostatic discharge (ESD) is the sudden flow of electricity between two electrically charged objects caused by contact, an electrical short, or dielectric breakdown.
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Heat sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels.
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Hot swapping
Hot swapping (frequently inaccurately called hot plugging) is replacing or adding components without stopping or shutting down the system.
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M.2
M.2, formerly known as the Next Generation Form Factor (NGFF), is a specification from 2013 for internally mounted computer expansion cards and associated connectors.
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Serial ATA
Serial ATA (SATA, abbreviated from Serial AT Attachment) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives, optical drives, and solid-state drives.
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Serial Attached SCSI
In computing, Serial Attached SCSI (SAS) is a point-to-point serial protocol that moves data to and from computer-storage devices such as hard drives and tape drives.
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Thermal design power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often the CPU or GPU) that the cooling system in a computer is designed to dissipate under any workload.
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