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14 relations: ASE Group, Chip-scale package, HTC One X, Integrated circuit, IPhone 5, List of integrated circuit packaging types, Raspberry Pi, Samsung Galaxy S III, Smartphone, Solder, Wafer (electronics), Wafer bonding, Wafer dicing, Wafer-scale integration.
ASE Group
Advanced Semiconductor Engineering, Inc. (日月光半導體製造股份有限公司), also known as ASE Group (日月光集團), is a provider of independent semiconductor assembling and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.
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Chip-scale package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
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HTC One X
The HTC One X is a touchscreen-based, slate-sized smartphone designed and manufactured by HTC.
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Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
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IPhone 5
The iPhone 5 is a smartphone designed and marketed by Apple Inc. It is the sixth generation of the iPhone, succeeding the iPhone 4S and preceding the iPhone 5S and iPhone 5C.
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List of integrated circuit packaging types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
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Raspberry Pi
The Raspberry Pi is a series of small single-board computers developed in the United Kingdom by the Raspberry Pi Foundation to promote the teaching of basic computer science in schools and in developing countries.
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Samsung Galaxy S III
The Samsung Galaxy S III (or Galaxy S3) is a Android smartphone designed, developed, and marketed by Samsung Electronics.
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Smartphone
A smartphone is a handheld personal computer with a mobile operating system and an integrated mobile broadband cellular network connection for voice, SMS, and Internet data communication; most, if not all, smartphones also support Wi-Fi.
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Solder
Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.
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Wafer (electronics)
A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
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Wafer bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation.
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Wafer dicing
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer.
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Wafer-scale integration
Wafer-scale integration, WSI for short, is a rarely used system of building very-large integrated circuit networks that use an entire silicon wafer to produce a single "super-chip".
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