Wafer backgrinding

Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ^[1]

7 relations: Back-illuminated sensor, Integrated circuit, Micrometre, Semiconductor device fabrication, Silicon, Wafer (electronics), Wafer dicing.

Back-illuminated sensor

A back-illuminated sensor, also known as backside illumination (BSI or BI) sensor, is a type of digital image sensor that uses a novel arrangement of the imaging elements to increase the amount of light captured and thereby improve low-light performance.

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Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.

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Micrometre

The micrometre (International spelling as used by the International Bureau of Weights and Measures; SI symbol: μm) or micrometer (American spelling), also commonly known as a micron, is an SI derived unit of length equaling (SI standard prefix "micro-".

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Semiconductor device fabrication

Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices.

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Silicon

Silicon is a chemical element with symbol Si and atomic number 14.

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Wafer (electronics)

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

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Wafer dicing

In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer.

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Redirects here:

Backlap, Wafer thinning.

References

[1] https://en.wikipedia.org/wiki/Wafer_backgrinding

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