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113 relations: Acetone, Aluminium, Antimony, Arsenic, Arsine, Asia, Atomic layer deposition, Boule (crystal), Broadcom Inc., Built-in self-test, California, Capacitor, Chemical vapor deposition, Chemical-mechanical planarization, Chip-scale package, Cleanroom, Cleanroom suit, Copper interconnect, Crystal growth, Czochralski process, Die (integrated circuit), Die preparation, Dopant, Dry etching, Dual in-line package, Dynamic random-access memory, Electronics, Electroplating, Ellipsometry, Epitaxy, Etch pit density, Etching (microfabrication), Europe, Flip chip, Furnace anneal, Gate dielectric, Glass, Hydrofluoric acid, Hydrogen peroxide, Ingot, Integrated circuit, Integrated circuit packaging, Intel, International Technology Roadmap for Semiconductors, Ion implantation, Lead, Lead frame, List of semiconductor fabrication plants, List of semiconductor materials, List of semiconductor scale examples, ..., LOCOS, Low-κ dielectric, Metrology, Microfabrication, Micrometre, Microprocessor, Middle East, Molecular beam epitaxy, Monocrystalline silicon, MOSFET, Nitric acid, Operating temperature, Passivation (chemistry), PC Card, Phosphine, Phosphorus, Photolithography, Photomask, Photoresist, Physical vapor deposition, Piranha solution, Planar process, Plasma ashing, Plating, Process corners, Process variation (semiconductor), Qimonda, Qualcomm, Rapid thermal processing, RCA clean, Reflectometry, Refractive index and extinction coefficient of thin film materials, Restriction of Hazardous Substances Directive, Samsung, Scan chain, SEMI, SEMI font, Semiconductor, Semiconductor consolidation, Semiconductor fabrication plant, Silane, Silicon, Silicon dioxide, Silicon on insulator, Silicon-germanium, Smart card, Solder, Stepper, Sulfuric acid, Tape-automated bonding, Texas, Thermal oxidation, Thermosonic bonding, Transistor, Trichloroethylene, Tungsten, Virtual metrology, Wafer (electronics), Wafer backgrinding, Wafer bonding, Wafer dicing, Wafer testing, Wire bonding. Expand index (63 more) »
Acetone
Acetone (systematically named propanone) is the organic compound with the formula (CH3)2CO.
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Aluminium
Aluminium or aluminum is a chemical element with symbol Al and atomic number 13.
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Antimony
Antimony is a chemical element with symbol Sb (from stibium) and atomic number 51.
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Arsenic
Arsenic is a chemical element with symbol As and atomic number 33.
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Arsine
Arsine is an inorganic compound with the formula AsH3.
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Asia
Asia is Earth's largest and most populous continent, located primarily in the Eastern and Northern Hemispheres.
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Atomic layer deposition
Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas phase chemical process.
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Boule (crystal)
A boule is a single crystal ingot produced by synthetic means.
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Broadcom Inc.
Broadcom Inc. (formerly Avago Technologies) is a designer, developer and global supplier of products based on analog and digital semiconductor technologies within four primary markets: wired infrastructure, wireless communications, enterprise storage, and industrial & others.
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Built-in self-test
A built-in self-test (BIST) or built-in test (BIT) is a mechanism that permits a machine to test itself.
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California
California is a state in the Pacific Region of the United States.
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Capacitor
A capacitor is a passive two-terminal electrical component that stores potential energy in an electric field.
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Chemical vapor deposition
Chemical vapor deposition (CVD) is deposition method used to produce high quality, high-performance, solid materials, typically under vacuum.
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Chemical-mechanical planarization
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces.
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Chip-scale package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
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Cleanroom
A cleanroom or clean room is a situation, ordinarily utilized as a part of assembling, including of pharmaceutical items or logical research, and in addition aviation semiconductor building applications with a low level of natural toxins, for example, tiny, airborne organisms, vaporized particles, and concoction vapors.
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Cleanroom suit
A cleanroom suit, clean room suit, or bunny suit, is an overall garment worn in a cleanroom, an environment with a controlled level of contamination.
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Copper interconnect
Copper-based chips are semiconductor integrated circuits which use copper for interconnections in the metalization layer, the BEOL.
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Crystal growth
Crystal growth is the process where a pre-existing crystal becomes larger as more molecules or ions add in their positions in the crystal lattice.
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Czochralski process
The Czochralski process is a method of crystal growth used to obtain single crystals of semiconductors (e.g. silicon, germanium and gallium arsenide), metals (e.g. palladium, platinum, silver, gold), salts and synthetic gemstones.
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Die (integrated circuit)
A die (pronunciation: /daɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.
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Die preparation
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing.
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Dopant
A dopant, also called a doping agent, is a trace impurity element that is inserted into a substance (in very low concentrations) to alter the electrical or optical properties of the substance.
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Dry etching
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.
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Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.
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Dynamic random-access memory
Dynamic random-access memory (DRAM) is a type of random access semiconductor memory that stores each bit of data in a separate tiny capacitor within an integrated circuit.
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Electronics
Electronics is the discipline dealing with the development and application of devices and systems involving the flow of electrons in a vacuum, in gaseous media, and in semiconductors.
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Electroplating
Electroplating is a process that uses an electric current to reduce dissolved metal cations so that they form a thin coherent metal coating on an electrode.
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Ellipsometry
Ellipsometry is an optical technique for investigating the dielectric properties (complex refractive index or dielectric function) of thin films.
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Epitaxy
Epitaxy refers to the deposition of a crystalline overlayer on a crystalline substrate.
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Etch pit density
The etch pit density (EPD) is a measure for the quality of semiconductor wafers.
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Etching (microfabrication)
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing.
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Europe
Europe is a continent located entirely in the Northern Hemisphere and mostly in the Eastern Hemisphere.
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Flip chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
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Furnace anneal
Furnace annealing is a process used in semiconductor device fabrication which consist of heating multiple semiconductor wafers in order to affect their electrical properties.
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Gate dielectric
A gate dielectric is a dielectric used between the gate and substrate of a field-effect transistor.
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Glass
Glass is a non-crystalline amorphous solid that is often transparent and has widespread practical, technological, and decorative usage in, for example, window panes, tableware, and optoelectronics.
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Hydrofluoric acid
Hydrofluoric acid is a solution of hydrogen fluoride (HF) in water.
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Hydrogen peroxide
Hydrogen peroxide is a chemical compound with the formula.
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Ingot
An ingot is a piece of relatively pure material, usually metal, that is cast into a shape suitable for further processing.
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Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
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Integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion.
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Intel
Intel Corporation (stylized as intel) is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley.
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International Technology Roadmap for Semiconductors
The International Technology Roadmap for Semiconductors (ITRS) is a set of documents produced by a group of semiconductor industry experts.
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Ion implantation
Ion implantation is low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the physical, chemical, or electrical properties of the target.
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Lead
Lead is a chemical element with symbol Pb (from the Latin plumbum) and atomic number 82.
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Lead frame
Lead frames are the metal structures inside a chip package that carry signals from the die to the outside.
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List of semiconductor fabrication plants
This is a list of semiconductor fabrication plants: A semiconductor fabrication plant is where integrated circuits (ICs), also known as microchips, are made.
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List of semiconductor materials
Semiconductor materials are nominally small band gap insulators.
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List of semiconductor scale examples
No description.
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LOCOS
LOCOS, short for LOCal Oxidation of Silicon, is a microfabrication process where silicon dioxide is formed in selected areas on a silicon wafer having the Si-SiO2 interface at a lower point than the rest of the silicon surface.
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Low-κ dielectric
In semiconductor manufacturing, a low-κ is a material with a small dielectric constant relative to silicon dioxide.
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Metrology
Metrology is the science of measurement.
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Microfabrication
Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller.
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Micrometre
The micrometre (International spelling as used by the International Bureau of Weights and Measures; SI symbol: μm) or micrometer (American spelling), also commonly known as a micron, is an SI derived unit of length equaling (SI standard prefix "micro-".
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Microprocessor
A microprocessor is a computer processor that incorporates the functions of a central processing unit on a single integrated circuit (IC), or at most a few integrated circuits.
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Middle East
The Middle Easttranslit-std; translit; Orta Şərq; Central Kurdish: ڕۆژھەڵاتی ناوین, Rojhelatî Nawîn; Moyen-Orient; translit; translit; translit; Rojhilata Navîn; translit; Bariga Dhexe; Orta Doğu; translit is a transcontinental region centered on Western Asia, Turkey (both Asian and European), and Egypt (which is mostly in North Africa).
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Molecular beam epitaxy
Molecular beam epitaxy (MBE) is an epitaxy method for thin-film deposition of single crystals.
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Monocrystalline silicon
Monocrystalline silicon (also called "single-crystal silicon", "single-crystal Si", "mono c-Si", or mono-Si) is the base material for silicon chips used in virtually all electronic equipment today.
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MOSFET
MOSFET showing gate (G), body (B), source (S) and drain (D) terminals. The gate is separated from the body by an insulating layer (white). surface-mount packages. Operating as switches, each of these components can sustain a blocking voltage of 120nbspvolts in the ''off'' state, and can conduct a continuous current of 30 amperes in the ''on'' state, dissipating up to about 100 watts and controlling a load of over 2000 watts. A matchstick is pictured for scale. A cross-section through an nMOSFET when the gate voltage ''V''GS is below the threshold for making a conductive channel; there is little or no conduction between the terminals drain and source; the switch is off. When the gate is more positive, it attracts electrons, inducing an ''n''-type conductive channel in the substrate below the oxide, which allows electrons to flow between the ''n''-doped terminals; the switch is on. Simulation result for formation of inversion channel (electron density) and attainment of threshold voltage (IV) in a nanowire MOSFET. Note that the threshold voltage for this device lies around 0.45 V The metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon.
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Nitric acid
Nitric acid (HNO3), also known as aqua fortis (Latin for "strong water") and spirit of niter, is a highly corrosive mineral acid.
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Operating temperature
An operating temperature is the temperature at which an electrical or mechanical device operates.
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Passivation (chemistry)
Passivation, in physical chemistry and engineering, refers to a material becoming "passive," that is, less affected or corroded by the environment of future use.
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PC Card
In computing, PC Card is a configuration for computer parallel communication peripheral interface, designed for laptop computers.
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Phosphine
Phosphine (IUPAC name: phosphane) is the compound with the chemical formula PH3.
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Phosphorus
Phosphorus is a chemical element with symbol P and atomic number 15.
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Photolithography
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate.
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Photomask
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern.
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Photoresist
A photoresist is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface.
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Physical vapor deposition
Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films and coatings.
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Piranha solution
Piranha solution, also known as piranha etch, is a mixture of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2), used to clean organic residues off substrates.
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Planar process
The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together.
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Plasma ashing
In semiconductor manufacturing plasma ashing is the process of removing the photoresist (light sensitive coating) from an etched wafer.
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Plating
Plating is a surface covering in which a metal is deposited on a conductive surface.
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Process corners
In semiconductor manufacturing, a process corner is an example of a design-of-experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer.
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Process variation (semiconductor)
Process variation is the naturally occurring variation in the attributes of transistors (length, widths, oxide thickness) when integrated circuits are fabricated.
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Qimonda
Qimonda AG was a memory company split out of Infineon Technologies (itself a spun off business unit of Siemens AG) on 1 May 2006, to form at the time the second largest DRAM company worldwide, according to the industry research firm Gartner Dataquest.
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Qualcomm
Qualcomm is an American multinational semiconductor and telecommunications equipment company that designs and markets wireless telecommunications products and services.
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Rapid thermal processing
Rapid thermal processing (RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (over 1,000 °C) on a timescale of several seconds or less.
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RCA clean
The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing.
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Reflectometry
Reflectometry uses the reflection of waves at surfaces and interfaces to detect or characterize objects.
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Refractive index and extinction coefficient of thin film materials
A.
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Restriction of Hazardous Substances Directive
The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.
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Samsung
Samsung is a South Korean multinational conglomerate headquartered in Samsung Town, Seoul.
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Scan chain
Scan chain is a technique used in design for testing.
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SEMI
SEMI (formerly Semiconductor Equipment and Materials International) is a global industry association of companies that provide equipment, materials and services for the manufacture of semiconductors, photovoltaic panels, LED and flat panel displays, micro-electromechanical systems (MEMS), printed and flexible electronics, and related micro and nano-technologies.
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SEMI font
SEMI Font, also known as SEMI OCR font, is used for marking silicon wafers in the semi-conductor industry.
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Semiconductor
A semiconductor material has an electrical conductivity value falling between that of a conductor – such as copper, gold etc.
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Semiconductor consolidation
Semiconductor consolidation is the trend of semiconductor companies collaborating in order to come to a practical synergy with the goal of being able to operate in a business model that can sustain profitability.
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Semiconductor fabrication plant
In the microelectronics industry a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory where devices such as integrated circuits are manufactured.
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Silane
Silane is an inorganic compound with chemical formula, SiH4, making it a group 14 hydride.
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Silicon
Silicon is a chemical element with symbol Si and atomic number 14.
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Silicon dioxide
Silicon dioxide, also known as silica (from the Latin silex), is an oxide of silicon with the chemical formula, most commonly found in nature as quartz and in various living organisms.
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Silicon on insulator
Silicon on insulator (SOI) technology refers to the use of a layered silicon–insulator–silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance, thereby improving performance.
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Silicon-germanium
SiGe, or silicon-germanium, is an alloy with any molar ratio of silicon and germanium, i.e. with a molecular formula of the form Si1−xGex.
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Smart card
A smart card, chip card, or integrated circuit card (ICC), is any pocket-sized card that has embedded integrated circuits.
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Solder
Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.
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Stepper
A stepper is a device used in the manufacture of integrated circuits (ICs) that is similar in operation to a slide projector or a photographic enlarger.
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Sulfuric acid
Sulfuric acid (alternative spelling sulphuric acid) is a mineral acid with molecular formula H2SO4.
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Tape-automated bonding
Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits.
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Texas
Texas (Texas or Tejas) is the second largest state in the United States by both area and population.
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Thermal oxidation
In microfabrication, thermal oxidation is a way to produce a thin layer of oxide (usually silicon dioxide) on the surface of a wafer.
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Thermosonic bonding
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers.
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Transistor
A transistor is a semiconductor device used to amplify or switch electronic signals and electrical power.
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Trichloroethylene
The chemical compound trichloroethylene is a halocarbon commonly used as an industrial solvent.
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Tungsten
Tungsten, or wolfram, is a chemical element with symbol W (referring to wolfram) and atomic number 74.
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Virtual metrology
In semiconductor manufacturing, virtual metrology refers to methods to predict the properties of a wafer based on machine parameters and sensor data in the production equipment, without performing the (costly) physical measurement of the wafer properties.
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Wafer (electronics)
A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
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Wafer backgrinding
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC).
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Wafer bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation.
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Wafer dicing
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer.
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Wafer testing
Wafer testing is a step performed during semiconductor device fabrication.
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Wire bonding
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
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References
[1] https://en.wikipedia.org/wiki/Semiconductor_device_fabrication
