Integrated circuit packaging and Thin Small Outline Package

Shortcuts: Differences, Similarities, Jaccard Similarity Coefficient, References.

Difference between Integrated circuit packaging and Thin Small Outline Package

Integrated circuit packaging vs. Thin Small Outline Package

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion. Thin Small Outline Package, or TSOP is a type of surface mount IC package.

Similarities between Integrated circuit packaging and Thin Small Outline Package

Integrated circuit packaging and Thin Small Outline Package have 5 things in common (in Unionpedia): Ball grid array, Chip carrier, Integrated circuit, Small Outline Integrated Circuit, Surface-mount technology.

Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

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Chip carrier

In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").

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Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.

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Small Outline Integrated Circuit

A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.

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Surface-mount technology

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).

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The list above answers the following questions

What Integrated circuit packaging and Thin Small Outline Package have in common
What are the similarities between Integrated circuit packaging and Thin Small Outline Package

Integrated circuit packaging and Thin Small Outline Package Comparison

Integrated circuit packaging has 49 relations, while Thin Small Outline Package has 9. As they have in common 5, the Jaccard index is 8.62% = 5 / (49 + 9).

References

This article shows the relationship between Integrated circuit packaging and Thin Small Outline Package. To access each article from which the information was extracted, please visit:

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