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Intel Core and Westmere (microarchitecture)

Shortcuts: Differences, Similarities, Jaccard Similarity Coefficient, References.

Difference between Intel Core and Westmere (microarchitecture)

Intel Core vs. Westmere (microarchitecture)

Intel Core is a line of mid-to-high end consumer, workstation, and enthusiast central processing units (CPU) marketed by Intel Corporation. Westmere (formerly Nehalem-C) is the name given to the 32 nm die shrink of Nehalem.

Similarities between Intel Core and Westmere (microarchitecture)

Intel Core and Westmere (microarchitecture) have 25 things in common (in Unionpedia): AES instruction set, Arrandale, Clarkdale (microprocessor), Clock rate, DDR3 SDRAM, Die shrink, Direct Media Interface, Gulftown, Intel Turbo Boost, LGA 1156, LGA 1366, Multi-core processor, Nehalem (microarchitecture), PCI Express, Sandy Bridge, Socket G1, SSE4, Thermal design power, Tick–tock model, X86, X86 virtualization, X86-64, Xeon, 32 nanometer, 45 nanometer.

AES instruction set

Advanced Encryption Standard instruction set (or the Intel Advanced Encryption Standard New Instructions; AES-NI) is an extension to the x86 instruction set architecture for microprocessors from Intel and AMD proposed by Intel in March 2008.

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Arrandale

Arrandale is the code name for a family of mobile Intel processors, sold as mobile Intel Core i3, i5 and i7 as well as Celeron and Pentium.

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Clarkdale (microprocessor)

Clarkdale is the code name for an Intel processor, initially sold as desktop Intel Core i5 and Core i3 and Pentium.

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Clock rate

The clock rate typically refers to the frequency at which a chip like a central processing unit (CPU), one core of a multi-core processor, is running and is used as an indicator of the processor's speed.

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DDR3 SDRAM

Double data rate type three SDRAM (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth ("double data rate") interface, and has been in use since 2007.

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Die shrink

The term die shrink (sometimes optical shrink or process shrink) refers to a simple semiconductor scaling of semiconductor devices, mainly transistors.

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Direct Media Interface

In computing, Direct Media Interface (DMI) is Intel's proprietary link between the northbridge and southbridge on a computer motherboard.

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Gulftown

Gulftown or Westmere-EP is the codename of an up to six-core hyperthreaded Intel processor able to run up to 12 threads in parallel.

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Intel Turbo Boost

Intel Turbo Boost is Intel's trade name for a feature that automatically raises certain of its processors' operating frequency, and thus performance, when demanding tasks are running.

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LGA 1156

LGA 1156, also known as Socket H or H1, is an Intel desktop CPU socket.

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LGA 1366

LGA 1366, also known as Socket B, is an Intel CPU socket.

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Multi-core processor

A multi-core processor is a single computing component with two or more independent processing units called cores, which read and execute program instructions.

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Nehalem (microarchitecture)

Nehalem is the codename for an Intel processor microarchitecture released in November 2008.

Intel Core and Nehalem (microarchitecture) · Nehalem (microarchitecture) and Westmere (microarchitecture) · See more »

PCI Express

PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X, and AGP bus standards.

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Sandy Bridge

Sandy Bridge is the codename for the microarchitecture used in the "second generation" of the Intel Core processors (Core i7, i5, i3) - the Sandy Bridge microarchitecture is the successor to Nehalem microarchitecture.

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Socket G1

Socket G1, also known as rPGA 988A (there are Socket G/rPGA 989 sockets that can take Socket G1/rPGA 988A or Socket G2/rPGA 988B packaged processors), is Intel's CPU socket for their line of mobile Core i7, the successor to the Core 2 line.

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SSE4

SSE4 (Streaming SIMD Extensions 4) is a SIMD CPU instruction set used in the Intel Core microarchitecture and AMD K10 (K8L).

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Thermal design power

The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often the CPU or GPU) that the cooling system in a computer is designed to dissipate under any workload.

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Tick–tock model

Tick–tock is a model adopted in 2007 by chip manufacturer Intel.

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X86

x86 is a family of backward-compatible instruction set architectures based on the Intel 8086 CPU and its Intel 8088 variant.

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X86 virtualization

In computing, x86 virtualization refers to hardware virtualization for the x86 architecture.

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X86-64

x86-64 (also known as x64, x86_64, AMD64 and Intel 64) is the 64-bit version of the x86 instruction set.

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Xeon

Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets.

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32 nanometer

The 32 nanometer (32 nm) node is the step following the 45 nanometer process in CMOS semiconductor device fabrication.

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45 nanometer

Per the International Technology Roadmap for Semiconductors, the 45 nanometer (45 nm) technology node should refer to the average half-pitch of a memory cell manufactured at around the 2007–2008 time frame.

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The list above answers the following questions

Intel Core and Westmere (microarchitecture) Comparison

Intel Core has 135 relations, while Westmere (microarchitecture) has 41. As they have in common 25, the Jaccard index is 14.20% = 25 / (135 + 41).

References

This article shows the relationship between Intel Core and Westmere (microarchitecture). To access each article from which the information was extracted, please visit:

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