Light-emitting diode and Thermal grease

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Difference between Light-emitting diode and Thermal grease

Light-emitting diode vs. Thermal grease

A light-emitting diode (LED) is a two-lead semiconductor light source. Thermal grease (also called CPU grease, heat paste, heat sink compound, heat sink paste, thermal compound, thermal gel, thermal interface material, or thermal paste) is a thermally conductive (but usually electrically insulating) compound, which is commonly used as an interface between heat sinks and heat sources (e.g., high-power semiconductor devices).

Aluminium nitride

Aluminium nitride (AlN) is a nitride of aluminium.

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Boron nitride

Boron nitride is a heat and chemically resistant refractory compound of boron and nitrogen with the chemical formula BN.

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Diamond

Diamond is a solid form of carbon with a diamond cubic crystal structure.

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Heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels.

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Phase-change material

A phase change material (PCM) is a substance with a high heat of fusion which, melting and solidifying at a certain temperature, is capable of storing and releasing large amounts of energy.

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Polymer

A polymer (Greek poly-, "many" + -mer, "part") is a large molecule, or macromolecule, composed of many repeated subunits.

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Silver

Silver is a chemical element with symbol Ag (from the Latin argentum, derived from the Proto-Indo-European ''h₂erǵ'': "shiny" or "white") and atomic number 47.

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Thermal adhesive

Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks.

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Thermal conductivity

Thermal conductivity (often denoted k, λ, or κ) is the property of a material to conduct heat.

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Thermally conductive pad

In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

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