Solder and Solder paste

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Difference between Solder and Solder paste

Solder vs. Solder paste

Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board.

Antimony

Antimony is a chemical element with symbol Sb (from stibium) and atomic number 51.

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Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

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Copper

Copper is a chemical element with symbol Cu (from cuprum) and atomic number 29.

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Eutectic system

A eutectic system from the Greek "ευ" (eu.

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Flux (metallurgy)

In metallurgy, a flux (derived from Latin fluxus meaning “flow”) is a chemical cleaning agent, flowing agent, or purifying agent.

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FR-4

FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material.

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Lead

Lead is a chemical element with symbol Pb (from the Latin plumbum) and atomic number 82.

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Printed circuit board

A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.

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Redox

Redox (short for reduction–oxidation reaction) (pronunciation: or) is a chemical reaction in which the oxidation states of atoms are changed.

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Reflow soldering

Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint.

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Restriction of Hazardous Substances Directive

The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.

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Rosin

Rosin, also called colophony or Greek pitch (pix græca), is a solid form of resin obtained from pines and some other plants, mostly conifers, produced by heating fresh liquid resin to vaporize the volatile liquid terpene components.

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Silver

Silver is a chemical element with symbol Ag (from the Latin argentum, derived from the Proto-Indo-European ''h₂erǵ'': "shiny" or "white") and atomic number 47.

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Solvent

A solvent (from the Latin solvō, "loosen, untie, solve") is a substance that dissolves a solute (a chemically distinct liquid, solid or gas), resulting in a solution.

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Stainless steel

In metallurgy, stainless steel, also known as inox steel or inox from French inoxydable (inoxidizable), is a steel alloy with a minimum of 10.5% chromium content by mass.

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Surface-mount technology

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).

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Tin

Tin is a chemical element with the symbol Sn (from stannum) and atomic number 50.

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Wave soldering

Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards.

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