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Thin Small Outline Package

Index Thin Small Outline Package

Thin Small Outline Package, or TSOP is a type of surface mount IC package. [1]

9 relations: Ball grid array, Chip carrier, EEPROM, Flash memory, Integrated circuit, PC Card, Small Outline Integrated Circuit, Static random-access memory, Surface-mount technology.

Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

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Chip carrier

In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").

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EEPROM

EEPROM (also E2PROM) stands for Electrically Erasable Programmable Read-Only Memory and is a type of non-volatile memory used in computers, integrated in microcontrollers for smart cards and remote keyless system, and other electronic devices to store relatively small amounts of data but allowing individual bytes to be erased and reprogrammed.

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Flash memory

Flash memory is an electronic (solid-state) non-volatile computer storage medium that can be electrically erased and reprogrammed.

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Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.

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PC Card

In computing, PC Card is a configuration for computer parallel communication peripheral interface, designed for laptop computers.

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Small Outline Integrated Circuit

A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.

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Static random-access memory

Static random-access memory (static RAM or SRAM) is a type of semiconductor memory that uses bistable latching circuitry (flip-flop) to store each bit.

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Surface-mount technology

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).

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References

[1] https://en.wikipedia.org/wiki/Thin_Small_Outline_Package

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