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Three-dimensional integrated circuit and University of Rochester

Shortcuts: Differences, Similarities, Jaccard Similarity Coefficient, References.

Difference between Three-dimensional integrated circuit and University of Rochester

Three-dimensional integrated circuit vs. University of Rochester

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The University of Rochester (U of R or UR) frequently referred to as Rochester, is a private research university in Rochester, New York.

Similarities between Three-dimensional integrated circuit and University of Rochester

Three-dimensional integrated circuit and University of Rochester have 1 thing in common (in Unionpedia): University of Rochester.

University of Rochester

The University of Rochester (U of R or UR) frequently referred to as Rochester, is a private research university in Rochester, New York.

Three-dimensional integrated circuit and University of Rochester · University of Rochester and University of Rochester · See more »

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Three-dimensional integrated circuit and University of Rochester Comparison

Three-dimensional integrated circuit has 52 relations, while University of Rochester has 254. As they have in common 1, the Jaccard index is 0.33% = 1 / (52 + 254).

References

This article shows the relationship between Three-dimensional integrated circuit and University of Rochester. To access each article from which the information was extracted, please visit:

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