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36 relations: ASML Holding, Computational lithography, Electron-beam lithography, Ellipse, Extreme ultraviolet, GlobalFoundries, IMEC, Immersion lithography, Interference lithography, Joseph Braat, Lawrence Livermore National Laboratory, Lift-off (microtechnology), List of laser articles, List of plasma physics articles, Lithography, Moore's law, Multigate device, Multiple patterning, Nanochemistry, Nanolithography, National Institute of Standards and Technology, Next-generation lithography, Optica Optics Software, Photolithography, Photomask, Planar process, Point spread function, Scanning probe lithography, SEMATECH, Stepper, Thomas J. Watson Research Center, Ultraviolet, X-ray lithography, 10 nanometer, 14 nanometer, 5 nanometer.
ASML Holding
ASML is a Dutch company and currently the largest supplier in the world of photolithography systems for the semiconductor industry.
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Computational lithography
Computational lithography (also known as computational scaling) is the set of mathematical and algorithmic approaches designed to improve the resolution attainable through photolithography.
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Electron-beam lithography
Electron-beam lithography (often abbreviated as e-beam lithography) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing).
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Ellipse
In mathematics, an ellipse is a curve in a plane surrounding two focal points such that the sum of the distances to the two focal points is constant for every point on the curve.
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Extreme ultraviolet
Extreme ultraviolet radiation (EUV or XUV) or high-energy ultraviolet radiation is electromagnetic radiation in the part of the electromagnetic spectrum spanning wavelengths from 124 nm down to 10 nm, and therefore (by the Planck–Einstein equation) having photons with energies from 10 eV up to 124 eV (corresponding to 124 nm to 10 nm respectively).
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GlobalFoundries
GlobalFoundries is an American semiconductor foundry headquartered in Santa Clara, California, United States.
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IMEC
Imec is an international R&D and innovation hub, active in the fields of nanoelectronics and digital technologies.
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Immersion lithography
Immersion lithography is a photolithography resolution enhancement technique for manufacturing integrated circuits (ICs) that replaces the usual air gap between the final lens and the wafer surface with a liquid medium that has a refractive index greater than one.
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Interference lithography
Interference lithography (or holographic lithography) is a technique for patterning regular arrays of fine features, without the use of complex optical systems or photomasks.
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Joseph Braat
Joseph J.M. Braat (born 5 November 1946) is a Dutch optical engineer.
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Lawrence Livermore National Laboratory
Lawrence Livermore National Laboratory (LLNL) is an American federal research facility in Livermore, California, United States, founded by the University of California, Berkeley in 1952.
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Lift-off (microtechnology)
Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (e.g. wafer) using a sacrificial material (e.g., Photoresist).
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List of laser articles
This is a list of laser topics.
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List of plasma physics articles
This is a list of plasma physics topics.
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Lithography
Lithography is a method of printing originally based on the immiscibility of oil and water.
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Moore's law
Moore's law is the observation that the number of transistors in a dense integrated circuit doubles about every two years.
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Multigate device
A multigate device or multiple-gate field-effect transistor (MuGFET) refers to a MOSFET (metal–oxide–semiconductor field-effect transistor) that incorporates more than one gate into a single device.
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Multiple patterning
Multiple patterning (or multi-patterning) is a class of technologies for manufacturing integrated circuits (ICs), developed for photolithography to enhance the feature density.
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Nanochemistry
Nanochemistry is the combination of chemistry and nanoscience.
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Nanolithography
Nanolithography is the branch of nanotechnology concerned with the study and application of fabricating nanometer-scale structures, meaning patterns with at least one lateral dimension between 1 and 1,000 nm.
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National Institute of Standards and Technology
The National Institute of Standards and Technology (NIST) is one of the oldest physical science laboratories in the United States.
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Next-generation lithography
Next-generation lithography or NGL is a term used in integrated circuit manufacturing to describe the lithography technologies slated to replace photolithography.
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Optica Optics Software
Optica is an optical design program used for the design and analysis of both imaging and illumination systems.
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Photolithography
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate.
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Photomask
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern.
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Planar process
The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together.
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Point spread function
The point spread function (PSF) describes the response of an imaging system to a point source or point object.
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Scanning probe lithography
Scanning probe lithography (SPL) describes a set of nanolithographic methods to pattern material on the nanoscale using scanning probes. It is a direct-write, mask-less approach which bypasses the diffraction limit and can reach resolutions below 10 nm.
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SEMATECH
SEMATECH (from Semiconductor Manufacturing Technology) is a not-for-profit consortium that performs research and development to advance chip manufacturing.
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Stepper
A stepper is a device used in the manufacture of integrated circuits (ICs) that is similar in operation to a slide projector or a photographic enlarger.
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Thomas J. Watson Research Center
The Thomas J. Watson Research Center is the headquarters for IBM Research.
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Ultraviolet
Ultraviolet (UV) is electromagnetic radiation with a wavelength from 10 nm to 400 nm, shorter than that of visible light but longer than X-rays.
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X-ray lithography
X-ray lithography, is a process used in electronic industry to selectively remove parts of a thin film.
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10 nanometer
In semiconductor fabrication, the International Technology Roadmap for Semiconductors (ITRS) defines the 10 nanometer (10 nm) node as the technology node following the 14 nm node. "10 nm class" denotes chips made using process technologies between 10 and 20 nanometers. All production "10 nm" processes are based on silicon CMOS finFET technology. "10nm" chip production started in 2016; product shipments started in 2017.
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14 nanometer
The 14 nanometer (14 nm) semiconductor device fabrication node is the technology node following the 22 nm/(20 nm) node.
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5 nanometer
In semiconductor manufacturing, the International Technology Roadmap for Semiconductors defines the 5 nanometer (5 nm) node as the technology node following the 7 nm node.
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EUV absorption in matter, EUV defects, EUV lithography, EUV tools, EUVL, Extreme Ultraviolet (EUV).
References
[1] https://en.wikipedia.org/wiki/Extreme_ultraviolet_lithography
