19 relations: Abrasive, Aluminium, Ångström, Colloid, Copper, Copper interconnect, Depth of field, Etching (microfabrication), Fracture, Integrated circuit, Photolithography, Polished, Polishing, RCA clean, Shallow trench isolation, Silicon nitride, Slurry, Topography, Wafer.
Abrasive
An abrasive is a material, often a mineral, that is used to shape or finish a workpiece through rubbing which leads to part of the workpiece being worn away by friction.
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Aluminium
Aluminium or aluminum is a chemical element with symbol Al and atomic number 13.
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Ångström
The ångström or angstrom is a unit of length equal to (one ten-billionth of a metre) or 0.1 nanometre.
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Colloid
In chemistry, a colloid is a mixture in which one substance of microscopically dispersed insoluble particles is suspended throughout another substance.
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Copper
Copper is a chemical element with symbol Cu (from cuprum) and atomic number 29.
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Copper interconnect
Copper-based chips are semiconductor integrated circuits which use copper for interconnections in the metalization layer, the BEOL.
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Depth of field
In optics, particularly as it relates to film and photography, the optical phenomenon known as depth of field (DOF), is the distance about the Plane of Focus (POF) where objects appear acceptably sharp in an image.
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Etching (microfabrication)
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing.
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Fracture
A fracture is the separation of an object or material into two or more pieces under the action of stress.
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Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
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Photolithography
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate.
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Polished
Polished is a short film directed by Ed Gass-Donnelly, featuring William B. Davis as a lonely aging businessman who yearns for human contact from shoeshiner Karyn Dwyer.
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Polishing
Polishing is the process of creating a smooth and shiny surface by rubbing it or using a chemical action, leaving a surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations.) In some materials (such as metals, glasses, black or transparent stones), polishing is also able to reduce diffuse reflection to minimal values.
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RCA clean
The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing.
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Shallow trench isolation
Shallow trench isolation (STI), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components.
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Silicon nitride
Silicon nitride is a chemical compound of the elements silicon and nitrogen.
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Slurry
A slurry is a thin sloppy mud or cement or, in extended use, any fluid mixture of a pulverized solid with a liquid (usually water), often used as a convenient way of handling solids in bulk.
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Topography
Topography is the study of the shape and features of the surface of the Earth and other observable astronomical objects including planets, moons, and asteroids.
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Wafer
In gastronomy, a wafer is a crisp, often sweet, very thin, flat, and dry biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes.
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Chemical mechanical planarisation, Chemical mechanical planarization, Chemical mechanical polish, Chemical mechanical polishing, Chemical-mechanical planarisation, Chemical-mechanical polishing.
References
[1] https://en.wikipedia.org/wiki/Chemical-mechanical_planarization