Faster access than browser!
34 relations: Ball grid array, Chip carrier, Chip-scale package, Copper conductor, Deformation (mechanics), Electronics, Finite element method, Integrated circuit, IPC (electronics), JEDEC, Lead frame, List of integrated circuit packaging types, Microchip Technology, Moisture sensitivity level, National Semiconductor, Original equipment manufacturer, Printed circuit board, Quad Flat No-leads package, Quad Flat Package, Reflow soldering, Shear stress, Small Outline Integrated Circuit, Solder, Solder fatigue, Solder mask, Surface-mount technology, Temperature cycling, Texas Instruments, Thermal expansion, Thousandth of an inch, Through-hole technology, Via (electronics), Weibull, Wire bonding.
Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
New!!: Quad Flat No-leads package and Ball grid array · See more »
Chip carrier
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips").
New!!: Quad Flat No-leads package and Chip carrier · See more »
Chip-scale package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
New!!: Quad Flat No-leads package and Chip-scale package · See more »
Copper conductor
Copper has been used in electrical wiring since the invention of the electromagnet and the telegraph in the 1820s.
New!!: Quad Flat No-leads package and Copper conductor · See more »
Deformation (mechanics)
Deformation in continuum mechanics is the transformation of a body from a reference configuration to a current configuration.
New!!: Quad Flat No-leads package and Deformation (mechanics) · See more »
Electronics
Electronics is the discipline dealing with the development and application of devices and systems involving the flow of electrons in a vacuum, in gaseous media, and in semiconductors.
New!!: Quad Flat No-leads package and Electronics · See more »
Finite element method
The finite element method (FEM), is a numerical method for solving problems of engineering and mathematical physics.
New!!: Quad Flat No-leads package and Finite element method · See more »
Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
New!!: Quad Flat No-leads package and Integrated circuit · See more »
IPC (electronics)
IPC, the Association Connecting Electronics Industries, is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies.
New!!: Quad Flat No-leads package and IPC (electronics) · See more »
JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.
New!!: Quad Flat No-leads package and JEDEC · See more »
Lead frame
Lead frames are the metal structures inside a chip package that carry signals from the die to the outside.
New!!: Quad Flat No-leads package and Lead frame · See more »
List of integrated circuit packaging types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
New!!: Quad Flat No-leads package and List of integrated circuit packaging types · See more »
Microchip Technology
Microchip Technology is an American manufacturer of microcontroller, memory and analog semiconductors.
New!!: Quad Flat No-leads package and Microchip Technology · See more »
Moisture sensitivity level
Moisture sensitivity level relates to the packaging and handling precautions for some semiconductors.
New!!: Quad Flat No-leads package and Moisture sensitivity level · See more »
National Semiconductor
National Semiconductor was an American semiconductor manufacturer which specialized in analog devices and subsystems, formerly with headquarters in Santa Clara, California, United States.
New!!: Quad Flat No-leads package and National Semiconductor · See more »
Original equipment manufacturer
An Original Equipment Manufacturer (OEM) is a company that produces parts and equipment that may be marketed by another manufacturer.
New!!: Quad Flat No-leads package and Original equipment manufacturer · See more »
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
New!!: Quad Flat No-leads package and Printed circuit board · See more »
Quad Flat No-leads package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards.
New!!: Quad Flat No-leads package and Quad Flat No-leads package · See more »
Quad Flat Package
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides.
New!!: Quad Flat No-leads package and Quad Flat Package · See more »
Reflow soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint.
New!!: Quad Flat No-leads package and Reflow soldering · See more »
Shear stress
A shear stress, often denoted by (Greek: tau), is the component of stress coplanar with a material cross section.
New!!: Quad Flat No-leads package and Shear stress · See more »
Small Outline Integrated Circuit
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30 to 50 % less than an equivalent dual in-line package (DIP), with a typical thickness that is 70 % less.
New!!: Quad Flat No-leads package and Small Outline Integrated Circuit · See more »
Solder
Solder (or in North America) is a fusible metal alloy used to create a permanent bond between metal workpieces.
New!!: Quad Flat No-leads package and Solder · See more »
Solder fatigue
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading.
New!!: Quad Flat No-leads package and Solder fatigue · See more »
Solder mask
Solder mask or solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
New!!: Quad Flat No-leads package and Solder mask · See more »
Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
New!!: Quad Flat No-leads package and Surface-mount technology · See more »
Temperature cycling
Temperature cycling (or temperature cycle) is the process of cycling through two temperature extremes, typically at relatively high rates of change.
New!!: Quad Flat No-leads package and Temperature cycling · See more »
Texas Instruments
Texas Instruments Inc. (TI) is an American technology company that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally.
New!!: Quad Flat No-leads package and Texas Instruments · See more »
Thermal expansion
Thermal expansion is the tendency of matter to change in shape, area, and volume in response to a change in temperature.
New!!: Quad Flat No-leads package and Thermal expansion · See more »
Thousandth of an inch
A thousandth of an inch is a derived unit of length in an inch-based system of units.
New!!: Quad Flat No-leads package and Thousandth of an inch · See more »
Through-hole technology
Through-hole technology (tht), also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
New!!: Quad Flat No-leads package and Through-hole technology · See more »
Via (electronics)
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic circuit that goes through the plane of one or more adjacent layers.
New!!: Quad Flat No-leads package and Via (electronics) · See more »
Weibull
Weibull is a Swedish locational surname.
New!!: Quad Flat No-leads package and Weibull · See more »
Wire bonding
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
New!!: Quad Flat No-leads package and Wire bonding · See more »
Redirects here:
Dual Flat No Lead, Dual Flat No leads, Dual Flat No-leads package, Dual flat no leads, HVQFN, LQFN, Micro Leadframe Package, MicroLeadFrame, QFN, Quad Flat No leads package, Quad flat no leads package, Quad-flat no-leads package, VQFN.
References
[1] https://en.wikipedia.org/wiki/Quad_Flat_No-leads_package
