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23 relations: Argon fluoride laser, ASML Holding, California, Carl Zeiss SMT, Dot-com bubble, Extreme ultraviolet, Immersion lithography, Integrated circuit, Krypton fluoride laser, Multiple patterning, OLED, Photolithography, Plasma (physics), San Diego, Semiconductor, Ultraviolet, University of California, San Diego, 130 nanometer, 180 nanometer, 32 nanometer, 45 nanometer, 65-nanometer process, 90 nanometer.
Argon fluoride laser
The argon fluoride laser (ArF laser) is a particular type of excimer laser, which is sometimes (more correctly) called an exciplex laser.
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ASML Holding
ASML is a Dutch company and currently the largest supplier in the world of photolithography systems for the semiconductor industry.
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California
California is a state in the Pacific Region of the United States.
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Carl Zeiss SMT
Carl Zeiss SMT GmbH comprises the Semiconductor Manufacturing Technology business group of ZEISS and develops and produces equipment for the manufacture of microchips.
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Dot-com bubble
The dot-com bubble (also known as the dot-com boom, the dot-com crash, the Y2K crash, the Y2K bubble, the tech bubble, the Internet bubble, the dot-com collapse, and the information technology bubble) was a historic economic bubble and period of excessive speculation that occurred roughly from 1997 to 2001, a period of extreme growth in the usage and adaptation of the Internet.
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Extreme ultraviolet
Extreme ultraviolet radiation (EUV or XUV) or high-energy ultraviolet radiation is electromagnetic radiation in the part of the electromagnetic spectrum spanning wavelengths from 124 nm down to 10 nm, and therefore (by the Planck–Einstein equation) having photons with energies from 10 eV up to 124 eV (corresponding to 124 nm to 10 nm respectively).
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Immersion lithography
Immersion lithography is a photolithography resolution enhancement technique for manufacturing integrated circuits (ICs) that replaces the usual air gap between the final lens and the wafer surface with a liquid medium that has a refractive index greater than one.
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Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon.
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Krypton fluoride laser
A krypton fluoride laser (KrF laser) is a particular type of excimer laser, which is sometimes (more correctly) called an exciplex laser.
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Multiple patterning
Multiple patterning (or multi-patterning) is a class of technologies for manufacturing integrated circuits (ICs), developed for photolithography to enhance the feature density.
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OLED
An organic light-emitting diode (OLED) is a light-emitting diode (LED) in which the emissive electroluminescent layer is a film of organic compound that emits light in response to an electric current.
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Photolithography
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate.
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Plasma (physics)
Plasma (Henry George Liddell, Robert Scott, A Greek English Lexicon, on Perseus) is one of the four fundamental states of matter, and was first described by chemist Irving Langmuir in the 1920s.
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San Diego
San Diego (Spanish for 'Saint Didacus') is a major city in California, United States.
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Semiconductor
A semiconductor material has an electrical conductivity value falling between that of a conductor – such as copper, gold etc.
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Ultraviolet
Ultraviolet (UV) is electromagnetic radiation with a wavelength from 10 nm to 400 nm, shorter than that of visible light but longer than X-rays.
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University of California, San Diego
The University of California, San Diego is a public research university located in the La Jolla neighborhood of San Diego, California, in the United States.
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130 nanometer
The 130 nanometer (130 nm) process refers to the level of semiconductor process technology that was reached in the 2000–2001 timeframe, by most leading semiconductor companies, like Intel, Texas Instruments, IBM, and TSMC.
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180 nanometer
The 180 nanometer (180 nm) process refers to the level of semiconductor process technology that was reached in the 1999-2000 timeframe by most leading semiconductor companies, like Intel, Texas Instruments, IBM, and TSMC.
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32 nanometer
The 32 nanometer (32 nm) node is the step following the 45 nanometer process in CMOS semiconductor device fabrication.
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45 nanometer
Per the International Technology Roadmap for Semiconductors, the 45 nanometer (45 nm) technology node should refer to the average half-pitch of a memory cell manufactured at around the 2007–2008 time frame.
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65-nanometer process
The 65-nanometer (65 nm) process is advanced lithographic node used in volume CMOS semiconductor fabrication.
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90 nanometer
The 90 nanometer (90 nm) process refers to the level of CMOS process technology that was reached in the 2004–2005 timeframe, by most leading semiconductor companies, like Intel, AMD, Infineon, Texas Instruments, IBM, and TSMC.
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References
[1] https://en.wikipedia.org/wiki/Cymer
