Thermal design power

The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. ^[1]

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Table of Contents

1. 32 relations: AMD, AMD 10h, AMD APU, AMD Turbo Core, AnandTech, Central processing unit, Computer cooling, Computer fan, Conroe (microprocessor), Data center, Dissipation, Graphics processing unit, Heat, Heat generation in integrated circuits, Heat sink, Intel, Intel Turbo Boost, Ivy Bridge (microarchitecture), Junction temperature, Laptop, Operating temperature, Opteron, Phoronix Test Suite, Power rating, POWER8, Server (computing), Steamroller (microarchitecture), System on a chip, Thermal conduction, Thermal radiation, TPC-C, Watt.

2. Computer engineering

AMD

Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and fabless semiconductor company based in Santa Clara, California, that designs, develops and sells computer processors and related technologies for business and consumer markets.

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AMD 10h

The AMD Family 10h, or K10, is a microprocessor microarchitecture by AMD based on the K8 microarchitecture.

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AMD APU

AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.

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AMD Turbo Core

AMD Turbo Core a.k.a. AMD Core Performance Boost (CPB) is a dynamic frequency scaling technology implemented by AMD that allows the processor to dynamically adjust and control the processor operating frequency in certain versions of its processors which allows for increased performance when needed while maintaining lower power and thermal parameters during normal operation.

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AnandTech

AnandTech is an online computer hardware magazine owned by Future plc.

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Central processing unit

A central processing unit (CPU), also called a central processor, main processor, or just processor, is the most important processor in a given computer.

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Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits.

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Computer fan

A computer fan is any fan inside, or attached to, a computer case used for active cooling.

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Conroe (microprocessor)

Conroe is the code name for many Intel processors sold as Core 2 Duo, Xeon, Pentium Dual-Core and Celeron.

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Data center

A data center (American English) or data centre (Commonwealth English)See spelling differences.

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Dissipation

In thermodynamics, dissipation is the result of an irreversible process that affects a thermodynamic system.

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Graphics processing unit

A graphics processing unit (GPU) is a specialized electronic circuit initially designed for digital image processing and to accelerate computer graphics, being present either as a discrete video card or embedded on motherboards, mobile phones, personal computers, workstations, and game consoles.

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Heat

In thermodynamics, heat is the thermal energy transferred between systems due to a temperature difference. Thermal design power and heat are heat transfer.

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Heat generation in integrated circuits

The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices.

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Heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. Thermal design power and heat sink are heat transfer.

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Intel

Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware.

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Intel Turbo Boost

Intel Turbo Boost is Intel's trade name for central processing units (CPUs) dynamic frequency scaling feature that automatically raises certain versions of its operating frequency when demanding tasks are running, thus enabling a higher resulting performance.

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Ivy Bridge (microarchitecture)

Ivy Bridge is the codename for Intel's 22 nm microarchitecture used in the third generation of the Intel Core processors (Core i7, i5, i3).

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Junction temperature

Junction temperature, short for transistor junction temperature, is the highest operating temperature of the actual semiconductor in an electronic device.

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Laptop

A laptop computer or notebook computer, also known as a laptop or notebook, is a small, portable personal computer (PC).

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Operating temperature

An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates.

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Opteron

Opteron is AMD's x86 former server and workstation processor line, and was the first processor which supported the AMD64 instruction set architecture (known generically as x86-64).

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Phoronix Test Suite

Phoronix Test Suite (PTS) is a free and open-source benchmark software for Linux and other operating systems.

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Power rating

In electrical engineering and mechanical engineering, the power rating of equipment is the highest power input allowed to flow through particular equipment.

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POWER8

POWER8 is a family of superscalar multi-core microprocessors based on the Power ISA, announced in August 2013 at the Hot Chips conference.

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Server (computing)

A server is a computer that provides information to other computers called "clients" on computer network.

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Steamroller (microarchitecture)

AMD Steamroller Family 15h is a microarchitecture developed by AMD for AMD APUs, which succeeded Piledriver in the beginning of 2014 as the third-generation Bulldozer-based microarchitecture.

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System on a chip

A system on a chip or system-on-chip (SoC; pl. SoCs) is an integrated circuit that integrates most or all components of a computer or other electronic system. Thermal design power and system on a chip are computer engineering.

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Thermal conduction

Conduction is the process by which heat is transferred from the hotter end to the colder end of an object. Thermal design power and Thermal conduction are heat transfer.

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Thermal radiation

Thermal radiation is electromagnetic radiation emitted by the thermal motion of particles in matter. Thermal design power and thermal radiation are heat transfer.

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TPC-C

TPC-C, short for Transaction Processing Performance Council Benchmark C, is a benchmark used to compare the performance of online transaction processing (OLTP) systems.

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Watt

The watt (symbol: W) is the unit of power or radiant flux in the International System of Units (SI), equal to 1 joule per second or 1 kg⋅m2⋅s−3.

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See also

Computer engineering

• AP Computer Science
• Algorithmic state machine
• Alpha strike (engineering)
• Application-specific integrated circuits
• Broadcast engineering
• Chamber of Computer Engineers of Turkey
• Computer architecture
• Computer engineering
• Computer engineering compendium
• Computer hardware
• Computer networking
• Computer science and engineering
• Computer systems
• Computing with Memory
• Control theory
• Daffodil Polytechnic Institute
• Digital signal processing
• Digital signal processor
• Electrical engineering
• Electronic engineering
• Embedded systems
• Empathy map
• Eyeball network
• Gajski–Kuhn chart
• Industrial data processing
• Integrated circuits
• List of electrical engineering software
• Logic synthesis
• Outline of computer engineering
• Perceived performance
• Processing delay
• Processor design
• Programmable logic controller
• Programmer (hardware)
• Queuing delay
• Reflected-wave switching
• Regularization by spectral filtering
• Remanence
• Rice University Electrical and Computer Engineering
• Signal processing
• Software engineering
• Sorting network
• System on a chip
• Test vector
• Thermal design power
• Tyranny of numbers
• Ultra-large-scale systems
• Valencia Koomson

References

[1] https://en.wikipedia.org/wiki/Thermal_design_power

Also known as Average CPU Power, CTDP, Configurable TDP, Configurable thermal design power, Nominal TDP, Programmable TDP, Programmable thermal design power, Scenario Design Power, TDP Power Cap, Thermal Design Point, Thermal throttling, Variable TDP.

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